Search results for "Master Bond"
Innovative TSMC-SoIC 3D chip stacking technology
It has been announced by Mentor, a Siemens business, that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified on TSMC’s 5nm FinFET process technology. Mentor also announced it has successfully completed reference flow materials in support of TSMC’s innovative System-on-Integrated-Chips (TSMC-SoIC) multi-chip 3D stacking technology.
From art to science – the development of the PCB
Let's start from the begining, the earliestPCBs were very much works of art.Etched by hand, they owed more to technology from artwork reproduction than to high tech.To create these circuits copper-clad boards were used. The artwork was hand-drawn, and once the track layout was defined, it was printed onto the board as an etch-resist mask. Acid was next used to etch away the exposed copper before another chemical removed the etch resist.
High-contrast OLED with USB interface
Especially for small monitoring and control tasks, the display specialist ELECTRONIC ASSEMBLY has developed a graphic OLED display with touch-sensitive front made of real glass. The brand new EA PLUGS102-6 is not only a display, but also a full control unit featuring a wide range of interfaces.
University kits up with Rohde & Schwarz equipment
Rohde & Schwarz has won a contract to supply test equipment for the Electronic Engineering IoT living laboratory at the University of Aalborg. The IoT living lab is central to the University’s teaching of Electronic Engineering, and used for experimental Internet of things (IoT) projects by technical staff, MEng and masters students.
Time sensitive networking to lead the way to Industry 4.0
The focus of the CC-Link Partner Association (CLPA) at Hannover Messe 2019 was CC-Link IE TSN, an Industry 4.0 focused open industrial Ethernet that offers a combination of gigabit bandwidth and Time Sensitive Networking (TSN) in order to ensure maximum performance, open connectivity and system intelligence. By John Browett, General Manager of CLPA Europe
Inspiration Rover project encourages children into STEM
Twelve young people recently enjoyed a day at Leicester’s National Space Centre, celebrating their achievements as part of educational outreach project Inspiration Rover.The project, which was led by mature student Henry Bennett from the University of Derby with support from fellow undergraduates, academics and alumni, saw the young people involved help develop a scale model of the Mars Science Laboratory Rover using a design from NASA Jet ...
Expanded line of SMA connectors optimised for low loss cable
Additional redesigned SMA connectors have been introduced by Amphenol RF, optimised for use with Low Loss 100 and 100A cable. Low Loss cables provide enhanced shielding with a bonded foil construction ensuring 100% coverage. These connectors feature a nominal impedance of 50 ohms and offer low return loss from DC to 12.4GHz.
Light fixation for two-component epoxy resins
A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.
Device development without sacrificing compliance
Balancing innovation and compliance is a challenge in any heavily regulated market with a large dependency on embedded software. Gerhard Kruger, Perforce Software, discusses further.
Structural adhesive supports Wisconsin Racing
Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, is a sponsor of Wisconsin Racing at the University of Wisconsin. DELO has supplied Wisconsin Racing’s Formula Electric team with DELO MONOPOX HT2860 to bond together the magnet segments in the car’s electric motor. The adhesive is also used for final rotor assembly.