Search results for "microprocessor"

OK International is a global supplier of soldering and adhesive bonding tools for the electronics assembly industry represented under its three brands: Techcon precision fluid dispsensing, Metcal premium soldering and array rework and OKi mainstream soldering, convection rework and fume extraction.

To further capitalize on the opportunity for Accelerated Processing Units in embedded applications and form factors, AMD today announced the formation of a new Embedded Solutions Group and appointed Arun Iyengar as its corporate vice president and general manager. The AMD Embedded Solutions Group will operate as a separate business within AMD's Global Business Units under AMD Senior Vice President Lisa Su.

Micronic Mydata AB launched a new Laser Direct Imaging solution it says will help manufacturers align to the future production needs of advanced electronics. At the same time as mobile phones, notebooks, PCs and other devices are growing smaller and more powerful, their functionality is becoming increasingly complex. A leap forward in direct imaging technology, the new Micronic Mydata LDI 5s Series will enable IC substrate producers to maintain c...

Charting a new course for the future of electronic systems, Deca Technologies has launched a breakthrough approach to creating advanced electronic interconnect solutions. Leveraging the unique, cost-effective solar wafer manufacturing methods of SunPower Corp. and financial, operational and manufacturing support from Cypress Semiconductor Corp. Deca’s proprietary solutions uniquely position it to reshape the way the world designs and manufactur...

Following a lackluster period of average annual market growth in the semiconductor industry, a significant upturn is in store for the next five years, according to data released in IC Insights’ Mid-Year Update to the 2012 McClean Report. The table below compares the cumulative average growth rates for the total semiconductor market and for several key product segments.

·All Devices to Converge on Jointly Developed UMC 65-nm eFlash Technology ·New IP Friendly Architecture Offers More Functionality, Lower Power Consumption ·Company Offers Sneak Peek at Next-Generation FPGAs for Space

Tektronix announced availability of a complete DDR2 protocol debug and validation solution for the award-winning TLA6000 Series Logic Analyzers. The new options for the TLA6000 Series consist of everything embedded engineers – even those who are not DDR2 experts – need to validate and debug the operation of memory sub-systems in their designs.

eoSemi has announced that Steve Cliffe has joined the company as VP of sales and marketing. His appointment demonstrates the company’s investment in a highly experienced management team following the closure of a £3 million Series-A equity round to develop and commercialise its first product.

Texas Instruments Incorporated today announced the industry’s first demonstration of a radio frequency (RF) system-on-chip (SoC) that integrates an IEEE 802.15.4 (2.4 GHz) radio, an ARM Cortex-M3 processor, dedicated Smart Energy (SE) 2.0 hardware security acceleration, and enough flash and RAM to run the ZigBee IP stack and SE2.0 profile.

AMD announced the appointments of Sam Naffziger and Leendert van Doorn to AMD Corporate Fellow for their leadership in power management technology and software development, respectively. Corporate Fellow is the highest level of technical recognition at AMD, with Naffziger and van Doorn becoming only the third and fourth employees to hold the position.