Search results for "electronica "

While everyone is talking about and exploring the potential of the IoT, security remains one of the biggest challenges. At electronica 2014, 11th to 14th November, exhibitors will present the latest security solutions for the networked era and the concurrent forums and conferences will feature security as one of the main topics.

NXP Semiconductors has introduced their line of multi-gate, multifunction, dual PCB configurable logic devices with Schmitt-trigger inputs. The Dual PCB Configurable Logic product line will be the centrepiece in a design contest featuring products from other NXP Business Units, including Smart Analog, Load Switches, Protection and Filtering, Small Signal MOSFETs, Small Signal Diodes, and other devices on the same evaluation board.

There can’t be a more suitable place show an automotive capacitor than Munich, home to BMW, so distributor TTI has chosen electronica to feature capacitors for high temperature automotive applications from Kemet. The devices are ideal for automotive applications above +125°C and up to +200°C, electric and hydraulic steering systems, electronic braking systems, engine and transmission control, as well as stop/start micro hybrid.

Renesas will introduce a wide line up of next-gen solution kits to acceleratecustomer design success through rich software functionality and added-value services on Renesas hardware platforms. Right out of the box, the solutions support designs in motor control, functional safety, industrial Ethernet, PROFINET IRT, I0-Link, reconfigurable sensors, PLC, wireless M-bus, 3-phase smart metering and next-gen HMI.

Introducing variants with three contact rows, ERNI Electronics expands it’s MicroSpeed high-speed connector family. High-speed data applications with up to 25Gb/s are enabled by the MicroSpeed Triple connector family, which has a 1mm pitch. A high contact density is provided by the three row versions with SMT terminals.

Free seminars will be on offer at Samtec’s stand during the electronica exhibition in Munich (Nov 11-14). The seminars focus on high speed interconnect design considerations, and will be presented by Scott McMorrow, President and SI Consultant of Teraspeed Consulting. They are 20 minutes in duration. Reservations are not required, and time will be available afterwards for questions and discussion.

Pentair will present the latest products from its Schroff brand with the Interscale case platform taking centre stage. Other product highlights in B1.243 will include MicroTCA and AdvancedTCA systems, subracks, electronics cabinets,the online Interscale M configurator tool and the Schroff Park2Power charging system.

Analog Devices will be demonstrating innovative solutions and hosting a series of demonstrations from its 'Analog to Anywhere' Technology Pavilion. Helping customers anticipate and solve their toughest design challenges, the highlighted solutions will enable customers to speed development time.

Texas Instruments will be exhibiting analogue and embedded processing semiconductors which enable innovative technologies for industrial and automotive designs. Visitors can participate in hands-on demonstrations showing how the right products and solutions can make development quick and easy, even for complex systems.

Fairchild has announced its 1200V Motion SPM 2 modules for high-voltage industrial applications. With motors responsible for more than 40% of the world’s power consumption, the new Smart Power Modules match Fairchild’s vision of making the world a cleaner, smarter place by enabling simple and reliable design, high thermal performance and full protection for systems using large 3-phase inverter motors for high energy efficiency.