Search results for "Infineon"

Infineon Technologies has announced the expansion of its Gallium Nitride (GaN)-on-Silicon technology and product portfolio. The company now offers both enhancement mode and cascode configuration GaN-based platforms optimised for high performance applications requiring superior levels of energy efficiency including Switch Mode Power Supplies (SMPS) used in servers and telecomms, and consumer goods such as Class D Audio systems. GaN technology sign...

Infineon Technologies has introduced the OptiMOS 5 25V and 30V product family, the next generation of power MOSFETs in standard discrete packages, a new class of power stages named Power Block, and in an integrated power stage, DrMOS 5x5.

Infineon Technologies has announced that more than 1bn ultra-small TVS diodes in the company’s bare silicon WLL package were delivered to customers in 2014.TVS diodes in WLL packages are used in applications where miniaturisation is a priority, including touch screen and keypad interfaces and the increasingly popular high-speed data ports used in mobile electronics.

Infineon Technologies has announced that it supplies the embedded Secure Element (eSE) chip for the new premium smartphones Samsung Galaxy S6 and S6 edge. Infineon’s SLE 97 is a SOLID FLASH-based eSE chip which can safeguard the functionalities of the mobile device as well as transactions where users’ sensitive data such as payment credentials are concerned.

Infineon Technologies has introduced embedded security controllers for premium handsets and smart wearables at Mobile World Congress 2015. The latest SOLID FLASH-based SLE 97 controllers provide what is claimed to be the industry’s highest memory capacity of up to 1.5MB in ultra-small packages.

Suitable for industrial and automotive M2M such as eCall and V2V communication, Infineon Technologies has introduced the SLM 97 and SLI 97 security controllers. The devices enable the full implementation of embedded SIM as defined by GSMA and ETSI, increasing flexibility and simplifying the deployment of new M2M solutions.

Designed for use in mobile and wearable gadgets and IoT devices, Infineon Technologies has announced an ultra-high ±5cm resolution, miniature MEMS pressure sensor. The DPS310 is a low-power digital barometric pressure sensor that enables the development of new and enhanced navigation, location, well-being, gesture recognition and weather monitoring applications.

Reducing power losses and improving reliability in EV and HEV applications, a family of robust 650V IGBTs has been introduced by Infineon Technologies. The automotive qualified TRENCHSTOP 5 AUTO IGBTs feature current ratings of 40 or 50A and are designed for on-board charging, PFC, DC/DC and DC/AC conversion.

At embedded world 2015, Infineon presented a device identity management solution for smart home applications. iBadge is a plug and play solution for secure connection of devices in the IoT. Thanks to iBadge, users can comfortably and securely access home networks via smartphone apps and cloud-based services to remotely switch on heating on the way home or access video surveillance while travelling.

At this year's embedded world, Infineon has announced the latest version of its development platformDAVE, the “Digital Application Virtual Engineer” for its 32-bit MCU familiesXMC1000andXMC4000. Infineon has equipped DAVE so that the development time for embedded systems on the basis of theXMC MCUsis reduced due to efficient, component-based software development.