Search results for "electronica"

TQ-Systems has opened a new development site at the TQ Technology Park in Peiting, Bavaria. It focuses on embedded systems with Intel Architecture – from hardware development to layout to system integration. TQ's development department is now distributed across five locations and involves a total of 150 employees.

MAZeT's JENCOLOR sensors team up with Dust SmartMesh technology (from Linear) to provide consistent light output across multiple LED lighting systems, a difficult and previously costly task. When merging LED and electronics components of different manufacturers, achieving and maintaining homogenous light output values proves a challenging task, especially for dynamic control options.

u-blox has introduced the NEO-M8L Automotive Dead Reckoning (ADR) module with integrated motion, direction and elevation sensors. The module integrates a gyroscope and an accelerometer with u‑blox’ leading GNSS platform M8, to achieve a high-performance indoor/outdoor positioning solution, available for all road vehicle and high-accuracy navigation applications.

STMicroelectronics is showcasing Life.Augmented from 11th to 14th November at electronica, in A5.207. ST’s offerings aim to deploy microelectronics more widely, creatively, and cost-effectively to address key societal challenges while enriching people’s daily lives.

GOEPEL electronics has launched the CION-LX Module/FXT96, a new Boundary Scan module with high functionality and dynamics for test of analogue, digital and mixed signals at the ITC International Test Conference 2014 in Seattle. The module allows the extension of Boundary Scan test to non scannable circuit components such as connectors, clusters or analogue interfaces.

Free seminars will be on offer at Samtec’s stand during the electronica exhibition in Munich (Nov 11-14). The seminars focus on high speed interconnect design considerations, and will be presented by Scott McMorrow, President and SI Consultant of Teraspeed Consulting. They are 20 minutes in duration. Reservations are not required, and time will be available afterwards for questions and discussion.

STMicroelectronics andComau are working together to develop next-gen robots, enabled by ST's control, smart power and sensing products,that maximise energy efficiency and improve factory safety.Cooperating since 2006, the companies' latest efforts focus on research for actuation and sensing to improve both the robot's spatial awareness and its interaction with operators. The ultimate goal of the partnership is to develop a new approach for roboti...

There can’t be a more suitable place show an automotive capacitor than Munich, home to BMW, so distributor TTI has chosen electronica to feature capacitors for high temperature automotive applications from Kemet. The devices are ideal for automotive applications above +125°C and up to +200°C, electric and hydraulic steering systems, electronic braking systems, engine and transmission control, as well as stop/start micro hybrid.

Renesas will introduce a wide line up of next-gen solution kits to acceleratecustomer design success through rich software functionality and added-value services on Renesas hardware platforms. Right out of the box, the solutions support designs in motor control, functional safety, industrial Ethernet, PROFINET IRT, I0-Link, reconfigurable sensors, PLC, wireless M-bus, 3-phase smart metering and next-gen HMI.

Introducing variants with three contact rows, ERNI Electronics expands it’s MicroSpeed high-speed connector family. High-speed data applications with up to 25Gb/s are enabled by the MicroSpeed Triple connector family, which has a 1mm pitch. A high contact density is provided by the three row versions with SMT terminals.