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After three exhibition days, full with the latest trends of power electronics, PCIM Asia 2015 ended with a positive result. Running concurrently with SPS Automation Shanghai, 101 exhibitors presented their latest products and services of power electronics in the Shanghai World Expo Exhibition Center.

It has been announced that Infineon Technologies has purchased all outstanding shares of LS Power Semitech. The strategic acquisition increases Infineon’s global footprint in the growing market segment of Intelligent Power Modules (IPM) which enable higher energy efficiency in consumer appliances such as refrigerators, freezers, washing machines, dryers and air conditioners.

At PCIM 2015, Infineon Technologies will present the latest generation of its PrimePACK power modules, which benefit from the new generation of Infineon’s IGBTs. The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies.

Featuring highly accurate 3D sensing with extremely low power consumption, the TLV493D-A1B6 3D magnetic sensor has been introduced by Infineon Technologies. Magnetic field detection in x, y and z axes allows the sensor to reliably measure 3D linear and rotation movements, while the implemented digital I²C interface enables fast and bidirectional communication between sensor and MCU.

The first packages for power semiconductors were very large, difficult to process and a challenge to cool well. Infineon has created the TO-Leadless power package for high-current applications. Ralf Walter, Infineon Technologies explains.

Supporting the trend from relay to more robust semiconductor solutions, Infineon Technologies has released its HITFET+ family of protected low-side switches. The HITFET+ family offers a compelling feature-set with its diagnosis function, digital status feedback and short-circuit robustness, and controlled slew rate adjustment for easily balancing switching losses and EMC compliance.

A set of Neutral Point Clamped (NPC) modules featuring Infineon IGBT H5 technology have been introduced by Vincotech. Offered in flow 0 and flow 1 housings, the modules combine high speed with low saturation voltages and outstanding switching characteristics.

Belden has developed the Connected Industry Platform (CIP) as a partner of Deutsche Telekom and in cooperation with Infineon Technologies and WIBU Systems. This platform, which was presented by Deutsche Telekom for the first time at this year's CeBIT, offers an innovative security concept for networked production.

The Best Paper and three Young Engineer Award winners were honoured during the opening ceremony of the PCIM Europe Conference 2015. From more than 300 high quality papers, the four contributions of the award winners convinced the conference directors.

Microelectronics is the key enabling technology for Industry 4.0, the networked production of the future. At the Hannover Messe, Infineon Technologies demonstrates how it supports a secure Industry 4.0.