Search results for "ASIC"
Cypress Introduces Easy-to-Use Graphical Software Tool For EZ-USB® FX3™ USB 3.0 Controller
Cypress Semiconductor Corp. announced today the immediate availability of its GPIF II Designer Software for EZ-USB FX3 Controllers for SuperSpeed USB 3.0. GPIF (General Programmable Interface) II Designer provides designers with a powerful, easy-to-use graphical interface to configure EZ-USB FX3’s programmable GPIF II interface to communicate with any microcontroller, ASIC, FPGA, Image Sensor or similar devices that need USB connectivity.
Cypress Japan Names Kazuyoshi Yamada Vice President of Strategic Accounts
Cypress Semiconductor announced that semiconductor industry veteran, Kazuyoshi “Kazu” Yamada, has joined Cypress Japan as Vice President, Japan Strategic Accounts. He will report to Hitoshi Yoshizawa, Cypress Vice President and Japan Managing Director. Yamada served in senior leadership roles at NEC’s semiconductor group and at Renesas for more than 33 years. Most recently, he was Senior Vice President of the System-on-Chip business unit at...
Cypress, Nuvation and Arrow Electronics Introduce New USB 3.0 SuperSpeed Interface Board for Altera FPGAs
Cypress Semiconductor Corp. and Nuvation Research Corp. today announced the production release of a rapid-prototyping solution that simplifies streaming video, images and other data from Altera FPGAs to a host processor at speeds up to 400 Megabytes per second.
Shortlink and LFoundry in RF and mixed-signal IP partnership
Shortlink AB and Landshut Silicon Foundry GmbH today announced a partnership agreement to provide Shortlink low power RF and mixed-signal custom IP in LFoundry's industry leading LF150 modular 150nm CMOS process technology.
Frost & Sullivan Recognizes Holst Centre and imec for Its Path Breaking Wearable Energy Harvester Technology
Based on its recent research on the wearable energy harvesters market, Frost & Sullivan presents Holst Centre and imec with the 2009 European Frost & Sullivan Award for Technology Innovation for its wearable electrocardiograph energy harvesting solution, which provides tens of microwatts of energy per square centimetre for modules with 3x4 cm2 dimensions. Due to its convenience of use, self powering, and low maintenance, this has opened the way f...
Imec unveils innovative technology for an ECG patch, combining an ultralow-power ECG SoC with Bluetooth Low Energy
Imec and Holst Centre announce an innovative body patch that integrates an ultra-low power electrocardiogram (ECG) chip and a Bluetooth Low Energy (BLE) radio. This unique combination fuses power-efficient electronics and standardized communication, opening new perspectives for long-term monitoring in health, wellness and medical applications. The system integrates components from imec and Holst Centre’s Human++ R&D program.
Imec and Altos collaborate on chip design and prototyping service
Imec and Altos Design Automation, Inc. today announce that they have entered into an agreement to set up a library re-characterization service based on Altos ultra-fast characterization tools. With this collaboration, imec will extend its ASIC (application-specific integrated circuit) prototyping and volume fabrication service with library re-characterization which is essential when designing in 65nm and 40nm nodes.
Imec and Holst Centre report ultra-low power heart activity signal processor
At today’s International Solid State Circuit Conference, imec and Holst Centre report an analog-signal processor ASIC (application-specific integrated circuit) – in short ASP - that reduces the overall power consumption of an ambulatory heart activity signal monitoring systems by more than 5 times. This is a major step towards autonomous wireless sensor systems, which constantly monitor the patient’s health for diagnosis of chronic illness.
Imec's Europractice IC service provides TSMC 40nm technologies to European companies and academia
Imec and TSMC today announced the extension of imec’s Europractice IC service with the offering of TSMC’s 40 nanometer technologies. Subsequent to the close collaboration between imec and TSMC on advanced technology research and development, both companies will offer TSMC’s CybershuttleTM Multi-Project Wafer (MPW) platform for IC prototyping and production services to European companies and academia.
Korenix Unveils New JetCon 2201i-wTB RS232 to RS422/485 Serial Converter with RS232 Terminal Block for Flexible Installation & Easy Maintenance!
Korenix extends its range of serial converters through the release of its newest JetCon 2201i-wTB Industrial RS232 to RS 422/485 Converter designed with a 5-pin terminal block on RS232 interface for providing flexible connectivity in various industrial applications. The new converter equipped with easy-access terminal block eliminates the need of using additional cables in specific installations, as a result becoming cost-effective and trouble fr...