Search results for "skills gap"
The Ohio State University's CDME goes big with 3D construction printing
Future professionals from The Ohio State University in US will develop their skills and learn to work with 3DCP technology to overcome the housing crisis.
Xaar aims to inspire STEM success with local school students
Continuing its collaboration with local schools and colleges, members of Xaar visited St. Peter’s School, Huntingdon for its recent STEM day. Supported by the engineering organisation, the Smallpeice Trust, over 50 local Year 10 students attended, with the day held on 18th January deemed a great success.
IPC give Garry McGuire, Teresa Rowe Hall of Fame award
In recognition of their extraordinary contributions to IPC and the electronics manufacturing industry, Garry McGuire, NASA and Teresa Rowe, IPC, were both inducted into the IPC Raymond E, IPC have announced. Pritchard Hall of Fame at IPC APEX EXPO 2023. IPC’s most prestigious honour, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Indium to sponsor and moderate IPC e-mobility webinar series
Indium Corporation is proud to sponsor the four-part e-mobility Electronics Hardware Reliability Webinar Series, hosted by IPC and moderated by Brian O’Leary, the company’s Global Head of e-mobility and Infrastructure and Chair of the IPC e-mobility Quality and Reliability Advisory Council.
One week left to enter prestigious engineering award
There is justoneweekleft for UK-based engineering innovators to submit entries for this year’sMacRobert Award – the longest running and most prestigious award for UK engineering innovation.
IC Blue celebrates 140% growth as it eyes US market expansion
IC Blue, the Leeds-based supplier of electronic components, is seeking another 20 linguists as the business continues to see significant international sales growth with revenues rising by over 139% in the last year alone.
RS unveils new tools for DesignSpark community
DesignSpark, RS Group’s online community for engineers, is now offering a suite of design tools including DesignSpark Mechanical and DesignSpark PCB.
SEMI ISS Europe 2023 to spotlight European Chips Act, semiconductor supply chain resilience and growth
The European Chips Act and Europe’s R&D capabilities – both key drivers of Europe’s microelectronics growth – will come into sharp focus at SEMI ISS Europe 2023 as industry executives, analysts, economists, policymakers and technologists gather 15th to 16th February in Vienna, Austria. Registration is open.
L-Charge named as a 2022 World Future Awards winner
L-Charge has been recognised for the development of a fast, off-grid, mobile EV-charging solution that uses clean fuels to generate power onboard, eliminating the need for any power grid connection.
Addressing manufacturing’s sustainability shortfalls
While COP27 reaffirmed the urgency of the climate crisis, concerns are rising around whether meeting global targets is feasible.