Search results for "microchip technology"

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.

Bourns has announced it has increased its line of Riedon Power Resistors with the release of 11 product series.

Infineon and Quantinuum have announced a strategic partnership to develop the future generation of ion traps.

The gender gap in generative AI usage is closing rapidly, fuelled by a significant increase in adoption among women. According to a new report from the Deloitte Centre for Technology, Media, and Telecommunications, the percentage of women using generative AI has tripled year-over-year, from just 11% in 2022 to 33% in 2023.

AI hardware startup GEMESYS has successfully raised €8.6 million in a pre-seed funding round led by the Amadeus APEX Technology Fund together with Atlantic Labs.

Nano Dimension has announced the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications.

A special tenth anniversary edition of the State of European Tech looks back over a decade of huge growth for the ecosystem and maps its superpower potential, set against significant challenges faced by the sector today.

Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power conversion, has announced the opening of its North American Design and Development Center in Ottawa, Ontario, Canada.

In today’s fast-paced digital landscape, efficient network monitoring and robust cybersecurity measures are crucial. Across the globe, 5.45 billion people now routinely use the internet, amounting to 67% of the global population. It should come as no surprise that this enormous number of users generates a vast amount of data, with U.S. citizens alone generating 3,138,420 GB of internet traffic every minute.

Printed circuit board assembly (PCBA) manufacturers rely on in-circuit test (ICT) systems to detect manufacturing processes and component defects. Manufacturers prefer ICT systems for testing electronic assemblies because they are easy to programme, have extensive fault coverage, rapid test throughput, low false fail rates, and outstanding diagnostic accuracy.