Search results for "Omnivision"
Image sensor combines ultra low light and near-infrared technologies
Advanced digital imaging solutions developer, OmniVision Technologies, has announced the OS02C10, a 2.9μm, two megapixel image sensor with ultra-low-light (ULL) technology. Combining ULL with OmniVision's Nyxel near-infrared (NIR) technology, the OS02C10 works equally well in all lighting conditions.
Shutter image sensors designed for machine vision applications
OmniVision has announced two new high resolution additions to its family of global shutter image sensors- the OG02B1B/OG02B10 and the OV9285. These new sensors are designed to be cost effective solutions for a wide range of consumer and industrial machine vision applications.
Automotive camera module reference design fits on single PCB
OmniVision Technologies has announced its high definition automotive camera module reference design, developed with collaboration from Leopard Imaging and featuring technology from Texas Instruments. The compact design includes OmniVision’sOX01B40image sensor plus Image Signal Processor (ISP) System-in-Package (SiP), as well as TI’sDS90UB933-Q1orDS90UB935-Q1serialiser chip and TPS65000-Q1 Power Management Integrated Circuit (PMIC).
Medical image signal processor with a shorter time to market
OmniVision has announced the OVMed, a new mixed-signal Image Signal Processor (ISP) designed for medical, veterinarian and industrial endoscopy applications. The OVMed ISP offers image processing features and high image quality. It also integrates easily with commercial hardware and software, and meets stringent medical certification standards, thus decreasing development cost and time to market, allowing designers to focus on developing differen...
5-megapixel colour imaging module enhances image quality
Availability of the Digilent Pcam 5C fixed-focus colour imaging module which is designed for use with FPGA development boards has been announced by RS Components. The module represents a reliable peripheral for electronics design engineers building devices with embedded camera applications.
Shaping the compact camera module industry
According toYole Développement (Yole), the CCM industry is moving slowly towards the consolidation phase with significant technology changes and supply chain evolution. In 2016, this ecosystem showed ten companies beyond $1bn in revenue. Within the CIS market segment for CCM applications, the three main players are sharing 75% of the total market. The CCM industry revenue was $23.4bn in 2016 and is expecting to reach $46.8bn in 2022.
Sensing changes in the automotive sensor market
The automotive market has witnessed many unexpected developments over the past two years, despite its age and maturity. As has always been the case, safety drives the market. Automotive OEMs and suppliers are now investing in technologies to develop autonomous and electric vehicles. Automation will spur the development of imaging and detection sensors like cameras, LiDAR, and radar, while electrification will boost the design of current and therm...
USB 3.0 camera features high performance ISP
Embedded camera solution company, e-con Systems, has announced the launch of See3CAM_81, an 8MP Autofocus USB 3.0 camera. See3CAM_81 is based on the 1/3.2" OV8865, an 8 MP CMOS image sensor from OmniVision. See3CAM_81 is a successor to e-con Systems’ 8MP autofocus USB 3.0 camera, See3CAM_80 based on OV8825. The See3CAM_81 streams uncompressed video 720p at 60fps (HD), 1080p at 30fps (cropped) and 8MP at 11 fps in YUY2 formats over USB 3.0 i...
Boldly zoom where no mobile camera has zoomed before
In order to produce a new dual-camera zoom reference design for mobile devices, OmniVision Technologies have announced its collaboration with dual-camera technology company Corephotonics. Combining OmniVision’s OV12A10 and OV13880 image sensors with Corephotonics’ proprietary zoom and Bokeh algorithms, the reference design brings optical zoom capabilities commonly found in DSCs and DSLRs to smartphone camera applications.
China’s MIC 2025 results for ICs predicted to fall short
The newly released 20thanniversary edition ofThe McClean Reportcontains an analysis of the three phases of China’s attempt to gain a stronger presence in the IC industry (Figure 1). The analysis of phase three includes a long list of the successes and setbacks that the Chinese have faced since initiating this strategy in 2014.