Search results for "stmicroelectronics"
Development boards reinforce support for 32-bit MCUs
Extending its support for the STM32 family of 32-bit Flash MCUs, STMicroelectronics has announced the STM32 Nucleo-144 series of low-cost, compact development boards. The 144-pin boards enhance the existing STM32 development ecosystem through increased connectivity that enables customers to quickly develop applications using any STM32 MCU, from the most power-efficient to the highest-performing devices.
The introduction of mbed IoT Device Platform
Semtech and ARM recently released LoRaWAN development through ARM mbed with LoRa-based shields and platforms. The LoRaWAN end-device source code, standardised by the LoRa Alliance, is also available through mbed simplifying device prototyping and accelerating the development of IoT applications.
STMicroelectronics to showcase its latest smart-driving solutions
STMicroelectronics will exhibit its latest Smart-Driving solutions at the 8th International Automotive Electronics Technology Expo (CAR-ELE JAPAN) in Tokyo, Japan. ST contributes to the development of cutting-edge Smart-Driving technologies including ADAS, connectivity, and advanced safety/environmental performance, with semiconductors playing a key role in the creation of these technologies.
'Graphics-centric' MCUs use ARM Cortex-M7 processors
Featuring rich memory, graphics and communication peripherals, the STM32F767/769 MCUs from STMicroelectronics bring ARM Cortex-M7 processing power and efficiency to applications such as consumer electronics, smart-building and industrial controllers, smart appliances and personal or point-of-care medical equipment.
MicroEJ to contribute initial code to open source project
At EclipseCon in Reston, Virginia, MicroEJ presented the Eclipse Edje open source project. Edje defined a set of software APIs required to deliver IoT services that meet the performance and memory constraints of MCU-based devices. Edje also provided ready-to-use software packages for targeted hardware that developers can get from third parties for quick and easy development of IoT device software and applications.
ARM contest stimulates innovation among young engineers
STMicroelectronics and ARM have announced the winners of the ARM - ST University Design Contest 2015 in China. The contest, now in its third year, encourages university students in China to design innovative smart applications using STM32 Nucleo boards as hardware platform and the GCC open-source compiler or the MDK-ARM software development environment.
STM32 sensor board supports 96Boards Consumer Edition
STMicroelectronics is sampling an STM32 MCU mezzanine board for 96Boards Consumer Edition (CE) platforms that simplifies development of smart mobile, embedded or digital-home devices. One of the first 96Boards CE small-mezzanine specification cards in the market, the B-F446E-96B01A simplifies development of context-aware functionality.
'The first' 4-ball WLCSP EEPROM with multiple I2C addresses
Extending its M24 serial EEPROM family, STMicroelectronics has announced four devices that are fully compatible with the industry-standard 4-ball Wafer Level Chip Scale Package (WLCSP) footprint. The additions enable, for the first time, two or more 4-pin EEPROMs to be connected to the same I2C bus with an individual I2C address hard-wired internally. This allows dedicated devices for specific purposes, such as front/rear camera modules, on the s...
MicroEJ to introduce operating system for IoT at Embedded World
At EclipseCon Europe, MicroEJ introduced MicroEJ Studio, its solution for application developers; at CES, it introduced the MicroEJ Application Store, its solution for delivering applications to IoT devices. At Embedded World in Nuremberg, Germany, MicroEJ will unveil the latest version of its MicroEJ OS.
EV Group joins IRT Nanoelec 3D integration programme
EV Group (EVG) has announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.