Search results for "Master Bond"
Auto Maintenance and Repair Expo 2020 returns
Auto Maintenance & Repair Expo (AMR) will return next spring from 15th-18th March 2020 at the Beijing’s New China International Exhibition Centre. Spanning across the 120,000sqm show floor of eight exhibition halls, more than 1,300 overseas and domestic exhibitors are expected to participate in the AMR 2020 fair.
Edwards Engineering install new blend centre for Broxburn Bottlers
Edwards Engineering has successfully managed the development and installation of a £700k, new Blend Centre for Broxburn Bottlers. Incorporating tanker receivals, transfers and dispatch, large vats, and cask filling and disgorging, the project was delivered in parallel with a Bonded Warehouse development.
Addressing the growing market for automotive traction inverters
ON Semiconductor has released the first two devices from its new VE-Trac family of power modulesfor high voltage automotive traction inverters. These two Power Integrated Module (PIM) devices bring electrical and thermal performance while providing scalability and automotive reliability to the rapidly growing market for traction inverters.
Demand for plasma applications prior to conformal coating process
Due to increasing miniaturisation and packing density on assemblies Plasmatreat has recorded a higher demand for Openair-Plasma in combination with conformal coatings in electronic manufacturing. Plasma application as pre-treatment to conformal coating of assemblies and components ensures that the process window for conformal coating is widened, guaranteeing long-lasting connections and functionality.
Lead frame cleaning process prominent at productronica
For the manufacture of semiconductors, the cleaning of metal surfaces before wire bonding or injection moulding of the semiconductor housing is still an important and necessary step. Contaminated and oxidised metal surfaces can cause low wire bond strength and lead to failures due to interruption of the electrical contacts.
Chip bonding adhesive delivers die shear strength of 60N/mm2
A thermally conductive, electrically insulating adhesive from DELO is available at distributor Inseto. The MONOPOX TC2270 is ideal for bonding silicon die and other applications where rapid heat transfer is essential. Heat build-up is a common reason for integrated circuit failure and the efficient dissipation of heat in power semiconductors, as used in automotive applications is a consdierable challenge.
Enabling mainstream microcontroller device security
IAR Systems has launched a new version of its security development tool C-Trust. Version 1.30 adds a new Security Context Profile that automatically includes the configurations needed for basic device security and Intellectual Property (IP) protection. In addition, IAR Systems has announced support for several devices from STMicroelectronics’ STM32F4 and L4 families, as well as NXP Semiconductors’ Kinetis K65 and K66 devices.
Native Red InGaN LEDs on silicon microLED displays
Plessey, an embedded technologies developer at the forefront of microLED technology for the Augmented Reality (AR) and display markets, has successfully developed a world’s first GaN on Silicon-based Red LED.Whilst InGaN-based Blue and Green LEDs are commercially available, Red LEDs are typically based on AlInGaP material or colour converted Red.
Driving business growth by digital transformation
Advantech held a two-day Industrial-IoT World Partner Conference (IIoT WPC) at Advantech’s IoT Campus in Linkou. It was the first large-scale partner conference since the IoT Co-Creation Summit held in Suzhou last year. This year, Advantech shared its insights and perspectives on how to confront Industrial IoT (IIoT) challenges in the future through the theme ofDriving Digital Transformation in Industrial IoT.
Filtronic spends $1.5m to meet E-band module demand
Filtronic has invested over $1.3 million in new equipment for its manufacturing facility to meet a growing demand for both its highly-integrated E-band transceiver modules for mobile telecoms backhaul infrastructure and its precision hybrid microelectronics assembly and test services, including mmWave device packaging and sub-assembly manufacturing.