Search results for "Infineon"

Where smartphone manufacturers differentiate their offers in a highly competitive market through either security or performance, Samsung chooses both. The world market leader builds its latest Samsung Galaxy S7 and Galaxy A devices with security and RF components from Infineon Technologies.

Mobile security is poised for growth as global mobile data traffic from smartphones is expected to increase ten-fold between 2014 and 2020. To provide the market with turnkey mobile security solutions, Infineon Technologies has introduced OPTIGA Mobile. The brand extends Infineon’s OPTIGA range of embedded security solutions with dedicated services around mobile security. OPTIGA Mobile helps mobile device manufacturers and OS providers to i...

Infineon Technologies and GoerTek has launched two high-resolution, highly integrated optical sensors. The optical chips deliver the precise measurement, small size and ultra-low power consumption demanded by ambient light sensing, proximity detection, heart rate and pulse oximetry monitoring applications in smart devices.

Unlike conventional mobile phones, smartphones are no longer primarily communication devices, but also tools for entertainment and work. Users run more and more applications in parallel, their smartphones constantly need to boost their performance. At Mobile World Congress in Barcelona, Infineon Technologies will present new solutions that make smartphones more powerful and more energy-efficient.

The world’s first EtherCAT node integrated on a standard ARM Cortex-M microcontroller, the new Infineon XMC4800 is in stock at distributor RS Components. It eases implementation of EtherCAT connectivity and saves PCB space usually occupied by a separate EtherCAT ASIC and its associated memory IC and oscillator crystal.

EtherCAT implementation complexity and cost can be reduced with the XMC4300 microcontroller series of Infineon Technologies. Without compromise to EtherCAT communication features, the XMC4300 has been specifically developed for cost-sensitive industrial applications that also make high demands on design flexibility, connectivity and real-time performance.

A comprehensive portfolio of sensors for applications within the Internet of Things will be showcased by Rutronik at Sensor+Test (May 10-12) in Nuremberg under the brand RUTRONIK SMART. This will comprise MEMS sensors, pressure sensors as well as magnetic and optical sensors from the leading manufacturers Bosch Sensortec, Diodes, Honeywell, Infineon, Melexis, Micronas, NJRC, Omron, Panasonic, Sensirion, STMicroelectronics and Vishay.

How to design ‘well-behaved’ high side gate drive circuits, by Paul Lee, Murata Power Solutions. The MGJ series, for example, has options for +15 or +20V. IGBTs and GaN MOSFETS will be fully ‘on’ with 15V drive but typical SiC MOSFETS may need closer to 20V for full enhancement.

Special model libraries for the TLE987x family of Infineon modules are now available for testing, validation and programming. GÖPEL electronic has made it possible to flexibly test and program those libraries identified as VarioTAP models using the SWD debug interface. This means that these Infineon modules can be used as instruments for prototype hardware design validation and production tests.

Chip-based payment solutions are easy to use and offer higher data security than magnetic stripe cards. In 2015, China took the pole position worldwide in terms of growth for both issuing volume and the transaction value with chip-based payment cards. As one of the first foreign chip suppliers, Infineon Technologies has received the “China UnionPay Security Product Certification” for its SLE77 security payment chip.