Search results for "ASIC"
Toshiba licenses ARM Cortex™-M3 32-bit RISC processor for ASIC and ASSP applications
Toshiba Electronics Europe (TEE) is now offering the synthesisable ARM Cortex™-M3 32-bit RISC processor for use across the company’s full range of ASIC technologies. Based on the license agreement with Toshiba Corporation, TEE can deploy the ARM Cortex–M3 core in high-performance, low power consumption, minimum pin count ASICs, ASSPs and other system on chip (SoC) solutions. Potential applications will include real-time industrial systems, ...
Toshiba - Physical layer and protocols provide complete MIPI IP solution for SoC development
The latest intellectual property from Toshiba Electronics Europe’s ASIC & Foundry Business Unit will simplify and speed the implementation of MIPI-compliant system-on-chip (SoC) designs for mobile phones and associated devices. The Toshiba MIPI (Mobile Industry Processor Interface) offering comprises a physical layer and protocols that build on this layer to support the rapid development of complete MIPI-compliant transmit and receive solutions...
Toshiba combines CMOS ASIC and eDRAM technologies to support rapid development of SIDSA mobile TV chipset
Toshiba has announced that the company’s CMOS ASIC process and Embedded DRAM (eDRAM) technology have played a key role in the development of a next generation system on chip (SoC) DVB-H IC from SIDSA, a leading supplier of mobile TV technology.
Ubidyne chooses Toshiba for wireless infrastructure SoC development
Ubidyne, a leader in digital antenna embedded radio technology for wireless communications, has employed Toshiba's TC300 90nm technology in the development of its D2.0 SoC (system on chip) digital up/down converter. The programme used a hybrid design flow that combined ASIC and COT (customer-owned tooling) methodologies to enable Ubidyne to concentrate on system design and the development of its own custom designed, high-speed, digital IP blocks ...
Arrow is NECs European S/LSI Design Win Distributor
Arrow Electronics has been named by NEC Electronics as its leading S/LSI design win distributor in Europe, based on the company’s demand creation activities. Arrow achieved the highest number of design wins and greatest overall lifetime value of business generated within NEC’s European distribution network during the period from April 2004 to April 2006.
SPiDCOM chooses Toshiba ASIC and mixed-signal IP technology for dual-core HomePlug AV SoC
SPiDCOM Technologies, the French fabless semiconductor company specializing in integrated circuits and Linux-based software bundles for Multimedia Home Networking, has used Toshiba’s 90nm CMOS ASIC platform, mixed-signal IP and European technical support services to develop its first HomePlug AV system-on-chip (SoC).
Toshiba offers access to mature technologies and long-life process support for European ASIC customers
Toshiba Electronics Europe (TEE) has announced that its ASIC and Foundry business unit is offering European customers long-life process support while continuing to make mature ASIC technologies available for new design starts. Both options will be particularly attractive to customers developing system-on-chip (SoC) solutions for industrial and other medium-volume applications where extended product lifecycles and/or cost optimized design are key ...
Fairchild Semiconductor’s IntelliMAX™ Load Switches Simplify Complex Power Design Challenges
Designers of higher-complexity consumer applications like set-top boxes, ultra-mobile PCs, mobile internet devices and eBooks need a power switch solution that can handle the battery management and green energy challenges associated with the higher load currents, lower supply voltages, larger batteries and more dynamic operating conditions found in these applications.
Mars Curiosity Rover Mission has Microsemi Space Solutions On Board
Microsemi has today extended its congratulations to NASA and the Jet Propulsion Lab for the historic landing of the Mars Curiosity rover. Several of Microsemi's space products were used in mission critical applications during the launch and flight to Mars, and continue to support the mission on the surface of Mars.
Tektronix meets design goals with 8HP SiGe Technology in 30+ GHz Oscilloscope Development
Tektronix announced that validation of ASICs designed in IBM’s 8HP silicon germanium (SiGe) BiCMOS Specialty Foundry technology are exceeding target specifications for a planned new performance oscilloscope capable of greater than 30 GHz bandwidth across multiple channels while minimizing noise found in older chip sets.