Search results for "vision systems"
Early access to MPLAB extensions brings Microchip tools to VS Code
Leveraging the versatility of Microsoft Visual Studio Code (VS Code), Microchip Technology has released an early access version of MPLAB Extensions for VS Code.
Meeting optical communication demands with InGaAs photodiodes
The conversion of light into electrical current is made possible by a crucial component – the photodiode.
Top 5 IoT products in June
Electronic Specifier walks through the top 5 IoT products released this June 2024.
Semiconductor manufacturing: Pre-, post-, and future trends with Rupal Jain
In an industry where the constant push for miniaturisation and enhanced performance shapes the future, the ability for semiconductor manufactures to pivot fast is crucial.
electronica 2024 to meet automotive industry challenges
electronica 2024 will bring answers to the major challenges facing the automotive industry, focusing on digitalisation and innovation.
Arrow's reference design for EV charger development
Arrow Electronics has introduced a data-communication reference design tailored for electric vehicle (EV) charging systems, incorporating advanced software protocols and a HomePlug Green PHY hardware module.
10BASE-T1S serial decoder augments oscilloscopes
Pico Technology has enhanced its PicoScope range. Effective immediately, all PicoScope oscilloscopes now include a serial decoder for the 10BASE-T1S automotive Ethernet standard.
Samtec expands Magnum RF Line with low-profile option
Samtec’s ganged, multi-port SMPM Magnum RF product family is now available with a low-profile 3.94mm (.155") body height, right-angle option for maximum channel density in low- or mid-band systems. Samtec’s GPPC Series offers the industry’s first low-profile, right-angle multi-port solution with performance out to 50 GHz.
Siemens introduces Innovator3D IC
Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.
STEMAZING webinar inspires inclusion
On 25th June 2024, Alexandra Knight, Founder and CEO of STEMAZING, hosted a rich and engaging webinar, 'Inspiring Inclusion in STEM.'