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New generation of high-voltage 600V SJ MOSFETs
Magnachip launches new generation of high-voltage 600V SJ MOSFETs for wide range of consumer products and industrial applications.
Renesas expands 5G mmWave Beamformer portfolio
Renesas has expanded its 5G beamformer IC family with two dual-polarisation mmWave devices optimised for 2x2 antenna architecture for 5G and broadband wireless applications.
Broadcom deal boosts Farnell test and measurement range
Farnell has strengthened its test and measurement product portfolio by addeing a new range of miniature spectrometers and associated evaluation kits from Broadcom.
e-con launches high-resolution monochrome USB camera
e-con systems has launched See3CAM_CU135M, a 13MP high-resolution monochrome USB 3.1 Gen 1 camera with superior sensitivity.
Machine learning solution in IoT & sensor collaboration
SensiML Corporation, a leading developer of AI tools for building intelligent Internet of Things (IoT) endpoints, today announced that it has teamed with onsemi to deliver a complete machine learning solution for autonomous sensor data processing and predictive modeling.
Season 5 – Episode #7: The evolution of C compiler testing
This week Anna Flockett spoke to Marcel Beemster, CTO of Solid Sands, about the importance of C compiler testing.
Congatec introduces real-time over the air platform
Congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices
"Industry's first" industrial temperature grade DDR5 and DDR4 registered clock drivers
Renesas,a supplier of advanced semiconductor solutions, has introduced what it claims is the industry’s first industrial temperature DDR5 (5RCD0148H) and DDR4 (4RCD0232K) registered clock drivers (RCDs).
Siemens collaborates with TSMC on design tool certifications
Siemens Digital Industries Software has announced that ongoing collaboration with longtime foundry partner TSMC has resulted in an array of new product certifications, and that the companies have reached key milestones for cloud-enabled IC design, as well as for TSMC 3DFabric, TSMC’s comprehensive family of 3D silicon stacking and advanced packaging technologies.
Humax to introduce total mobility platform at MOVE2021
Humax, a total mobility platform provider, will showcase its all-in-one mobility hub, smart EV charging, and digitalised fleet management at MOVE2021 (9-10 November, London ExCeL)