Search results for "ASIC"

With pressure from modern broadband wireless standards such as LTE to minimise out-of-band emissions and to maintain power efficiency, it is more important than ever to ensure effective linear amplification from power amplifiers (PAs). Digital pre-distortion (DPD) is a fundamental building block used in wireless communication systems today for better efficiency. By reducing the distortion created by running power amplifiers in their non-linear re...

Timesys today introduced the availability of its award-winning LinuxLink framework for development on the Xilinx Zynq-7000 All Programmable SoC in the ZC702 Evaluation Kit based on the Linux 3.3 kernel. Timesys LinuxLink for the Zynq-7000 All Programmable SoC represents the industry's premier Linux offering designed specifically to minimize the complexity of embedded Linux development and ensure a minimum time-to-market for Zynq-7000 All Programm...

Toshiba has announced that it can now offer European ASIC customers a flexible process development and foundry manufacturing service built around its 8” (200mm) CMOS wafer fabrication capabilities. The service combines support for special processes, process modifications and bespoke process development with cost-effective medium- and high-volume manufacturing that is backed by a commitment to long-term supply.

In keeping with good tradition CREATIVE CHIPS GmbH exhibits at electronic 2012 show in Munich. The successful growing company presents its latest solutions for custom-specific ICs (ASICs) and ASSPs in hall A4, booth no. 512. The German fabless semiconductor vendor develops and manufactures an extensive portfolio of ASICs/ASSPs.

MicroVision, Inc and Intersil Corporation today announced an agreement to partner on the development of advanced, integrated chipsets (ASICS) for MicroVision’s patented high definition (HD) PicoP display technology. This collaboration is expected to strengthen the technology and business roadmap for PicoP display technology by: • integrating advanced features such as virtual touch and proximity sensing • increasing brightness • reduc...

Agilent has revealed that it will demonstrate a 32-Gb/s bit error ratio tester at ECOC (Amsterdam RAI, Hall 1, Stand 712) in Amsterdam, Sept. 17-19. The N4960A high-performance modular bit error ratio tester is suitable for product design, device characterization and production test of devices and systems operating up to 32 Gb/s. The instrument is available in 17-Gb/s and 32-Gb/s configurations.

Omron has developed new super-sensitive sensor for non-contact thermal measurement that makes full use of proprietary Omron MEMS sensing technology. The D6T sensor, operating on infrared radiation sensing principle, is very suitable for human detection. It can detect the presence of people in an area without the need for movement and thus it is an outstanding alternative to pyroelectric sensors or PIR detectors in home automation, building automa...

Cadence Design Systems today announced that the first products in the Cadence DDR4 SDRAM PHY and memory controller design intellectual property family have been proven in silicon on TSMC’s 28HPM and 28HP process technologies.

STMicroelectronics today announced a strategic agreement with MicroOLED, a Grenoble, France-based company dedicated to the development and commercialization of state-of-the-art organic light emitting diodes (OLEDs), as well as a minority equity investment of approximately 6 million Euros in the company. With exceptionally high resolution and extremely low power consumption that is the most power efficient on the market, OLEDs are ideally suited t...

Kionix today announced the release of the KXCNL, a configurable accelerometer with dual state machines to allow designers to dynamically program the device for numerous applications. The KXCNL’s dual state machines allow the device to simultaneously run multiple applications at the chip level, taking significant processing load off the system’s main applications processor and conserving power.