Search results for "spectrum analysis"

Samtec has announced full production quantity availability of its LL043 Series Nitrowave high-performance microwave cable assembly.

Ahead of Black Hat MEA in Riyadh from 26-28 November 2024, Cisco released insights intokey cybersecurity trendsthat emerged between July and September 2024.

Arteris, Inc. and MIPS announced a partnership to provide a pre-verified reference platform to support mutual customers.

Richardson Electronics, Ltd. and Navitas Semiconductor announced an expanded distribution partnership for next-gen silicon carbide (SiC)power semiconductorsfor Europe, the Middle East, and Africa (EMEA).

MintNeuro, a pioneer of scalable, low-powersemiconductor technologyfor minimally invasive neural implant applications, has raised £1 million in a funding round led by Empirical Ventures.

The Chomerics Division of Parker Hannifin Corporation has launched a rapid sampling and prototyping laboratory in the Czech Republic.

Anritsu Corporationhas joined the OpenROADM Multi-Source Agreement (MSA), which defines specifications that facilitate multi-vendor interoperability for optical transmission networks.

Electronic Specifier highlights the top 10 stories fromelectronica 2024, the world’s leading trade fair for electronics.

At embedded world North America,congatec unveiledits latest hardware and software offerings designed to streamline product development and improve time-to-market for its customers.

SECO S.p.A. and NXP Semiconductors announce a significant milestone in their partnership: SECO’s Clea software platform will be available to all NXP silicon users and seamlessly integrated with NXP’s EdgeLock 2GO service platform.