Search results for "microchip"
Digi-Key at embedded world 2023 with Microchip Technology
At embedded world 2023, on the Digi-Key booth, Kristian McCann speaks with Martin Kellermann, Marketing Business Development Manager at Microchip Technology about intelligent Edge computing with RISC-V.
Microchip’s new E-Fuse demonstrator board
To provide Battery Electric Vehicle (BEV) and Hybrid Electric Vehicle (HEV) designers with a faster and more reliable high-voltage circuit protection solution, Microchip Technology has announced the E-Fuse Demonstrator Board,enabled by SiC technology, available in six variants for 400–800V battery systems and with a current rating of up to 30A.
KYOCERA advanced ceramics for the semiconductor industry
KYOCERA has further developed its high-end ceramic Starceram N3000 P and has launched a new silicon nitride for the functional testing of next-generation microchips.
Microchip expands its secure authentication IC portfolio
Microchip has announced it has expanded its secure authentication device portfolio with six new products in its CryptoAuthentication and CryptoAutomotive IC families that meet Common Criteria Joint Interpretation Library (JIL) High rated secure key storage and support certified algorithms that comply with the Federal Information Processing Standard (FIPS).
Microchip aiming to triple semiconductor production at its Oregon facility
Microchip has reached a milestone in its multi-year, $800 million initiative aiming to triple production capacity at its Gresham, Oregon manufacturing facility.
Controlling molecular electronics with rigid, ladder-like molecules
As electronic devices continue to shrink, the limitations of physical size are increasingly hindering the ability to double transistor density on silicon microchips every two years, a trend known asMoore’s law.
Amorphous silicon carbide: a breakthrough for microchips
Researchers at Delft University of Technology, led by Assistant Professor Richard Norte, have made a pertinent breakthrough in material science with the development of amorphous silicon carbide (a-SiC).
Würth Elektronik at electronica 2024
Würth Elektronik has announced that it will be exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024.
IDS: Wired with micrometre precision
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.
Leading edge semiconductor research on 200/300mm wafers
The Fraunhofer Institute for Photonic Microsystems IPMS, situated in Silicon Saxony, provides both large-scale chip manufacturers and smaller entities access to cutting-edge photonic microsystems technology.