Search results for "Toshiba"

Toshiba Electronics Europe has revealed details of its new BiCD process, which combines 130nm logic design rule with current-handling capability to permit unprecedented integration in devices such as sensorless BLDC motor drives. The process is able to guarantee full specification over a wide temperature range, as well as high ESD robustness, providing a platform for a variety of industrial and automotive IC projects.

Toshiba Electronics Europe (TEE) vient d'étendre sa famille de circuits intégrés MPD (circuits périphériques mobiles) en introduisant une solution compacte, de faible consommation et versatile qui peut être mise en œuvre en mode hub ou bridge dans des applications conçues autour des plus récents standards MIPI® (Mobile Industry Processor Interface) série haute vitesse.

Toshiba Electronics Europe (TEE) vient d'étendre sa gamme de circuits de commande de DEL de haute précision avec un modèle 9 canaux qui présente une interface bus I2C et une capacité de courant constant en sortie pouvant atteindre 50mA par canal.

Toshiba Corporation annonce ce jour l'introduction d'un module de mémoire Flash NAND embarquée de 128 Go, soit la plus haute densité atteinte jusqu'ici dans l'industrie. Le module est totalement compatible avec le plus récent standard e•MMCTM, et a été conçu pour servir dans une vaste gamme de produits numériques pour le grand public comme les téléphones intelligents, les PC au format tablette et les caméras vidéo numériques. Des �...

Discomp, a subsidiary of Rutronik Elektronische Bauelemente GmbH, was presented again with an award by Toshiba. With this year's Award of Appreciation for Business Commitment and Dedication, the distributor was distinguished for selling the most hard discs to the industrial market in 2009.

A ranking of the 1Q12 top semiconductor suppliers is included as part of IC Insights' soon-to-be-released May Update to The McClean Report. Intel remained firmly in control of the number one spot in the ranking. In fact, Intel extended its lead over second-ranked Samsung by registering a 68% higher sales level than Samsung in 1Q12 as compared to a 48% margin for all of 2011.

Yole Développement is pleased to release its 3DIC & TSV Interconnects 2012 Business Update report. In this report, Yole Développement provides an update of the 3DIC & TSV technology market. Yole Développement’s analysts define the market forecast for the next 5 years and provide deeper understanding of supply chain challenges and moves that are currently happening in this fascinating “middle-end” industry space.

Making sense of images captured by cameras in today’s Advanced Driver Assistance Systems requires sophisticated microprocessors with specific feature sets. But what makes a good image processor? Sally Ward-Foxton investigates.

Panasonic Corporation has announced that its software development processes have been certified for ISO 26262[1], a functional safety[2] standard for road vehicles, by TUV SUD in Germany, a third-party certification authority. Panasonic's automotive equipment and device software development processes have been recognized as compliant with up to the highest Automotive Safety Integrity Level (ASIL-D) defined in ISO 26262. To obtain the certificatio...

Marktech has expanded its lineup of Toshiba White surface mount LEDs aimed at general and backlighting applications with the release of the Toshiba TLWxK1109 series. The new 1109 series LEDs are offered in three Lighting Industry standard color temperatures of 3000K, 5000K and 6500K. As with all Toshiba products, the highest level of manufacturing processes are used to insure a very robust LED for use in all lighting applications.