Search results for "Master Bond"
Battery electric city buses: a $25bn market in 2030
The bus market is at a crossroads. The pressing need for cities around the world to improve air quality, alongside commitments by many governments to address climate change, are powering plans to deliver zero on-road emission battery electric city bus solutions. Over the next decade these efforts will see major cities increasingly refuse to purchase anything but zero-emission buses, as they deliver on promised zero-emission zones to protect the h...
AEC-Q101 discretes in miniature rugged DFN packages
Nexperia has announced a wide portfolio of automotive-qualified AEC-Q101 discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.
How can deep learning benefit manufacturing?
In Christopher Nolan’s 2010 masterpieceInception, the protagonist is a corporate spy who steals information by infiltrating people’s dreams, exploring the different layers of his victims’ subconscious to find a path to the desired information. Deep learning, a specialised form of machine learning, works in a similar way, recreating the complex architectures of our brain’s neural networks to find information hidden in big d...
VICTREX AM PEAK filament for additive manufacturing
Victrex has launched VICTREX AM PEAK filament. The new offering has been specifically developed and optimised for additive manufacturing. The PEEK incumbent materials on the market today, although used in some AM applications, were designed for conventional manufacturing methods, such as machining and injection moulding.
Electronic component protection for IoT devices
One of the latest electroniccomponentprotection methods being used in the consumer IoT industry is plasma nano-coating technology. This technology is already widely used in consumer electronics and works by using plasma to bond an invisibly thin, ultra-light, uniform layer of polymer to surfaces – providing protection from water damage and corrosion to treated PCBAs’ (printed circuit board assembly) electrical components.Simon Vogt, C...
PFC controller maintains a 180° phase shift
Texas Instruments' UCC28065 interleaved PFC controller enables transition-mode PFC at higher power ratings than previously possible.
ESD safe materials to accelerate 3D printing in electronics manufacturing
Material choice is one of the key considerations for an engineer when it comes to choosing a manufacturing method; and they can benefit greatly from having access to ESD safe materials (electrostatic discharge)which are critical for 3D printing electrostatic sensitive fixtures, enclosures, and parts. Brandon Sweeney, Head of R&D for Materials and Co-founder of Essentium, explains further.
Hammond IP66 steel enclosures for control housing
The IP66 EJSS family from Hammond Electronics is available in 304 or 316 grade stainless steel, supplied as standard in a natural smooth brushed finish. Sealed to IP66, the EJSS is designed for use as an instrument enclosure, an electric, hydraulic or pneumatic control housing, electrical junction box or terminal wiring enclosure.
Intertronics supplies Born2Bond cyanoacrylate adhesives
Adhesives specialist Intertronics has been appointed as distributor of Born2Bond, a new range of cyanoacrylate (CA) adhesives suitable for bonding applications in high technology industries such as medical devices, electronics assembly, and automotive manufacturing and aftermarket.
ASMPT and IBM Research collaborate on AI chip technology
With the dawn of the Artificial Intelligence (AI) era upon the world, the usual playbook of continuous shrinking and packing more and more transistors into chipsets will become unsustainable. New AI chip architecture, materials and manufacturing processes will be needed, in order to meet the requirements and realise the potential of the AI-enabled world.