Search results for "circuit breakers"
Lotus announces the Emeya built on NVIDIA DRIVE
Lotus has announced the all new Emeya, which is built in parentship with NVIDIA DRIVE.
Production test: the key to supplying the highest quality ASICs
One of the most desirable trends in electronics system design is to push as much functionality as possible into a single device.
Top-cooled RF amplifier modules shrink 5G radios
5G base station operators will be able to deploy smaller, thinner and lighter radio units following NXP Semiconductors launch of a family of top-cooled RF amplifier modules.
GaN breaks down design barriers
The performance advantages of GaN are well understood and the challenges of driving GaN HEMTs have been overcome. Remaining concerns may be price, availability and reliability, says Dr Denis Marcon, General Manager, Innoscience Europe.
Kaman Measuring highlights KD-5100+ differential measurement system
The Measuring Division of Kaman Precision Products highlights the availability of its KD-5100+ high reliability differential displacement measurement system, with nanometre resolution.
New gen of SPAD devices for near-infrared applications
X-FAB Silicon Foundries SE, an analog/mixed-signal and specialty foundry, has introduced a near-infrared version of its single-photon avalanche diode (SPAD) device portfolio.
New high voltage SMD Reed Relays at productronica 2023
Pickering Electronics, a manufacturer of high-performance reed relays, will present its latest high voltage surface mount reed relay, Series 219, at stand #452 in Hall A1 during productronica.
The future of smart textiles in daily life
Smart textiles are changing how we interact with the environment around us; fabrics are moving beyond their traditional roles to become integral and interactive components in our everyday lives.
3-mode 1A LDO regulator from Nisshinbo
Nisshinbo Micro Devices has announced the launch of the NR1641 for applications requiring low noise power supply and power-saving features.
Siemens, SPIL collaborate on 3D verification workflow
Siemens Digital Industries Software has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries (SPIL) to develop and implement a new integrated circuit (IC) package assembly planning and 3D layout vs. schematic (LVS) assembly verification workflow for SPIL’s fan-out family of advanced IC packaging technologies.