Search results for "Infineon"

Higher efficiency, increased power density, smaller footprints and reduced system costs: these are the main advantages of transistors based on SiC. Infineon Technologies is starting volume production for the Easy 1B, the first full-SiC module announced during PCIM 2016. At PCIM 2017, the company showcased additional module platforms and topologies for the 1200V CoolSiC MOSFET family. Infineon is now able to bring the potential of SiC technology t...

Later this month,IC Insights will release its May Update to the 2017McClean Report. This update includes a discussion of the 1Q17 semiconductor industry market results, an update of the capital spending forecast by company, a review of the IC market by electronic system type, and a look at the top 25 1Q17 semiconductor suppliers (the top ten 1Q17 semiconductor suppliers are covered in this research bulletin).

Contactless card and touch-and-go mobile technology payments are on the rise: especially consumers and commuters in highly populated urban areas require higher transaction speeds and more convenience. Infineon helps card and device manufacturers and transport operators to cope with the security and performance challenges of this trend.

Leti has announced that its embedded sensor fusion solution, SigmaFusion, has been embedded in Infineon Technologies’ AURIXTC29x platform. This platform enables automotive developers to control powertrain, body, safety and ADAS applications with one single microcontroller family.

Infineon has introduced the CIPOS Mini, featuring power factor correction (PFC). The intelligent power module (IPM) combines a single switch boost PFC stage and a 3 phase inverter in one package. With the PFC integrated into the inverter module, the integrated CIPOS Mini IPM helps to reduce system size and the bill of material. Moreover, the additional PCB space gives room for further components.

The EU Agency for Network and Information security –ENISA– together with industry recently reached acommon positionon cybersecurity, that reflects the concerns of industry and provides a set of suggestions for policy makers. The paper focuses on four main areas actively debated at the EU level: standardisation and certification, security processes and services, security requirements and implementation, and the economic dimensions.

One of the most important European research projects for energy efficiency, “eRamp”, is coming to a close. Over the past three years, 26 partners from business and science have explored innovative electronics components for using energy even more efficiently. Their focus was on the rapid introduction of new production technologies, such as packaging technologies for energy-saving chips. The eRamp project covered the entire power elect...

As the EU’s Artemis EMC2 project draws to a close on 30th May 2017, Sundance Multiprocessor Technology has declared its participation a resounding success. Sundance’s role in the project has been to architect and develop the hardware platform on which the project’s applications could be demonstrated.This hardware demonstration platform, which also forms the basis of Sundance’s commercially available EMC2-compliant PC/104 p...

“Productive4.0”, the largest European research initiative to date in the field of Industry 4.0, has been launched at Infineon Technologies in Dresden. Coordinated by Infineon, more than 100 partners from 19 European countries will work on digitising and networking industry. Involved in the project are partners such as BMW, Bosch, Philips, Thales, NXP, STM, SAP, ABB, Volvo and Ericsson, and leading institutes such as the Karlsruhe Inst...

The car manufacturer Toyota has awarded Infineon Technologies with its ‘Best Quality Award’.The ‘Best Quality Award’ is presented to suppliers for achieving zero defects for three years running. Infineon was acknowledged for deliveringCAN transceiversof outstanding quality.