Search results for "optical computing"

The Chomerics Division of Parker Hannifin has introduced THERM-A-GAP PAD 80LO, a high-performance thermal gap pad with low oil-bleed and migration characteristics.

Ventec and Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.

RED Semiconductor has won a place to join the semiconductor industry’s highly acclaimed Silicon Catalyst Incubator programme.

Renesas has launched the new generation of automotive fusion system-on-chips (SoCs) serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single-chip.

AMDshowcased its ongoing high performance computing (HPC) leadership at Supercomputing 2024 by powering the world’s fastest supercomputer for the sixth straight Top500 list.

Arteris, Inc. and MIPS announced a partnership to provide a pre-verified reference platform to support mutual customers.

AMD announced the AMD Versal Premium Series Gen 2, an adaptive SoC platform designed to deliver the highest levels of system acceleration for a wide range of workloads.

Altus Grouphas announced its participation in the Southern Manufacturing & Electronics show, held from 4-6 February 2025 at the Farnborough International Exhibition Centre.

Anritsu Corporationhas joined the OpenROADM Multi-Source Agreement (MSA), which defines specifications that facilitate multi-vendor interoperability for optical transmission networks.

ScioSense has launched a two-channel time-to-digital converter (TDC) which offers the very high time measurement resolution and high output data rate required in LiDAR systems.