Search results for "miniaturisation"

Altus Group has announced growing interest in Scienscope X-ray inspection systems from electronics manufacturers in Europe.

Panasonic Industry has released new PhotoMOS SOP4 AQY212G3HS and AQY232G3HS MOSFET relays.

Mouser Electronics, the New Product Introduction (NPI) pioneer empowering innovation, announces a newe-bookin collaboration withMurata, exploring the use of micro-electromechanical systems (MEMS) technology device design.

Nexperia announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data lines in interfaces such as USB, HDMI, high-speed video links and Ethernet in automotive infotainment applications.

ROHM has developed a compact 2.0mm × 1.0mm proximity sensor, the RPR-0720, optimised for applications requiring attachment/detachment and proximity detection.

Modern electronic assemblies are becoming more complex with an increasing number of components. This makes it difficult to fit all parts into the limited space available for printed circuit boards (PCBs).

In the past, constructors and designers used incandescent bulbs as indicator lamps to signal the operating status of equipment (start-up, failure, or cycle stage). Over the years, these have been replaced by LEDs.

Samsung Electro-Mechanics is launching a high-performance CLLC-resonant MLCC (multi-layer ceramic capacitor) that offers 22nF at 1,000V.

Insight SiP launches its ISP3080 UWB-BLE module. This device offers integration and miniaturisation of RF technologies, using System in Package technology. The device also benefits from Insight SiP’s proprietary ‘Antenna-in-Package’ techniques.

KYOCERA AVX has released the new RES Series radial-leaded aluminium electrolytic capacitors.