Search results for "electronic propulsion"
"Tip of the iceberg": WPC announces Qi2 expansion
The Wireless Power Consortium (WPC) has announced the continued expansion of Qi2 adoption, as new wireless power applications are rolling out through 2025, including an acceleration in Qi2 Android devices.
QT Group launches platform to build digital applications
QT Group has launched QT Accelerate: an express-lane solution to buiding applications in digital products for use cases such as industrial manufacturing, mobility, consumer electronics and more.
Sivers Semiconductors wins major chip development programme
Sivers Semiconductors announced that it has been awarded a major chip development programme by a leading Tier-1 telecom infrastructure vendor.
Navigating the mega-trends reshaping industrial IoT
The Industrial Internet of Things (IIoT) is moving into a new era of extreme change, driven by new technologies and fundamental shifts in how industries operate.
Navitas at CES 2025
At CES 2025, Paige West, Managing Editor, Electronic Specifier speaks with Llew Vaughan-Edmunds, Senior Director, Product Management & Marketing (GaN, SiC), Navitas about delivering next-generation solutions for AI datacentres, EVS, and mobile technology.
RTI Connext Drive chosen for vehicle communications
Real Time Innovations (RTI) recently announced that XPENG has chosen RTI Connext Drive to provide core communication technology for its E/E vehicle architecture.
Indium to show gold solder solutions at MD&M West
Indium will feature its high-reliability AuLTRA MediPro gold solder solutions at MD&M West, running 4-6 February in Anaheim, California.
3D printing geopolymers from Lunar Soils – GLAMS Project
Funded by ASI – the Italian Space Agency, the two-year GLAMS Project (Geopolymers for Additive Manufacturing and Lunar Monitoring) aims to create structural elements for the construction of lunar bases through a 3D printing approach that uses cement binders extracted from lunar soils (regolith).
Aven launches latest tweezers line
Aven is pleased to announce the launch of its EZ Grip Tweezers line, high-performance tools designed for precision, durability and comfort, to meet the demands of electronic assembly, repair and laboratory applications.
Honeywell and NXP expand partnership for aviation tech
Honeywell and NXP Semiconductors have announced at CES 2025 an expanded partnership that will accelerate aviation product development and chart the path for autonomous flight.