Search results for "data storage"
Coal is playing a vital role in next-generation electronics
The University of Illinois Urbana-Champaign, along with its research partners, has embarked on an innovative journey, demonstrating how coal, traditionally a contributor to climate change, can be reimagined as a key component in the future of electronics.
Leading innovators vie for UK’s top engineering award
AI-powered weather forecasting, innovative heat batteries using phase-changing materials, and the rapid manufacturing scale-up of a COVID-19 vaccine are competing for a prize for engineering innovation.
PCIM Europe 2024: the highlights
With PCIM Europe 2024 now behind us, what better time to look back at the trends, innovations, and discussions happening within the power electronics industry.
Intel expands Ethernet range
Intel has expanded its Ethernet 800 series with the addition of the Ethernet Network Adapter E810-XXVDA2, a high-performance and versatile 10/25GbE adapter featuring two 25GbE SFP28 ports.
New Honeywell solution jumpstarts gigafactories from day one
Honeywell has announced the launch of its Battery Manufacturing Excellence Platform (Battery MXP), an AI-powered software solution designed to optimise gigafactory operations from the outset.
Alphawave, Samsung partnership extended to 2nm processes
Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.
About:Energy accelerates battery management system innovation
About:Energy revealed a technology demonstrator for battery management systems developed with support from STMicroelectronics.
Cryptomathic secures Belgium's digital ID
The Federal Public Service Policy and Support (BOSA) partnered with Cryptomathic to launch one of Europe's pioneering digital identity wallets.
ASMPT combine high-speed chip assembly with SMT placement
With its new SIPLACE CA2 hybrid placement solution ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs (system-in-package modules) directly into the SMT line.
Cervoz unveils U.3 enterprise SSD
Cervoz has unveiled its new U.3 enterprise SSD for big data applications and modern enterprise.