Search results for "Nordson"
Automated fluid dispensing systems on show at MD&M West
Nordson EFD has revealed that it will be demonstrating a series of automated fluid dispensing systems in booth #3335 at MD&M West, 10th to 12th February in California. These closed-loop systems combine precise dispensing with fast and easy programming, meaning that they ensure that the dispensing process stays in control and are easily integrated into any manufacturing operation.
Automated board assembly line offers rigorous testing
With the use of HDI printed circuit boards, more densely populated boards using high pin count BGAs, QFNs and LGAs, micro BGAs, and smaller and smaller devices including 10005s, it seems that assemblies should be getting smaller in size. However, in some cases printed circuit boards are getting larger, prompting Javad EMS (JEMS) to make a sizeable investment to provide large PCB capability to customers.
Thin die tester meets SEMI standard
Nordson DAGE has introduced a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns. Die with thickness below 50 microns tend to be very compliant, in fact so much so that it becomes virtually impossible to apply a test load.
Shanghai to pay host to electronica & productronica
The leading events for the electronics and electronics production industries in Asia, electronicaand productronica China 2015 will run concurrently from 17th to 19th March 2015, in halls E3 - E5, at the Shanghai New International Expo Centre. Together, the tradeshows will cover 57,500 square metres of exhibition space, in which over 900 exhibitors and 56,000 visitors will discuss the latest products and technologies in the electronics industry.
Conformal coating system chosen by Czech company
A Nordson ASYMTEK Select Coat SL-940E selective conformal coating has been sold by its distributor, the Amtest Group to APRI in the Czech Republic, to automate its conformal coating process. The system has enabled APRI to increase capacity, improve repeatability, and ensure a more uniform and accurately applied conformal coating process.
X-Ray metrology tool claimed to be faster & more precise
Nordson DAGE has announced its most recent order from a major customer in the semiconductor industry for its XM8000 wafer X-ray metrology tool. It will be used for the automatic measurement of wafer bumps and Through Silicon Vias (TSVs) using 2D and 3D x-ray inspection methods.
BGA failures under discussion at Scotland Technology event
Peter Koch, European X-Ray Application Engineer, at Nordson Dage is lined up to present at their Distributor Etek’s Technology Event, in Prestwick, Scotland (Nov 5-6). He will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.” Koch will discuss failures on BGAs, HiP (Head in Pillow) defects, cracks and simple failures such as solder bridges.
Automated fluid dispensing systems integrate vision sensing
Designed for integration into any manufacturing operation, the PRO series of automated fluid dispensing systems has been released by Nordson EFD. Vision and laser height sensing is integrated with closed-loop encoding. This provides an automated solution which has advanced dispensing capabilities and is quick and easy to set up, programme and operate.
Two-day Technology Event takes place in Scotland
Following a successful two-day event held in Romania earlier this month, Etek Europe has revealed that it will be hosting a two-day Technology Event from 5th to 6th November 2014 at its Technology Centre in Prestwick, Scotland.
Nordson DAGE to discuss X-ray inspection at SMTAI
At the upcoming SMTA International exhibition, Dr. Evstatin Krastev, Director of Applications, Nordson DAGE, will present two papers. Dr. Krastev co-authored both papers, titled: 'X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding' and 'Optimizing X-ray Inspection with Package on Package'.