Search results for "CUI Devices"
Navitas showcases GaN and SiC technologies at CES 2025
Navitas Semiconductor will showcase several breakthroughs for AI datac centres, EVs and mobile technology at CES 2025, running in Las Vegas from 7-10 January.
CC2745P10-Q1 by Texas Instruments
The SimpleLink CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE).
Yokogawa launches SMU to speed chip development
Yokogawa Test & Measurement’s AQ2300 series high-performance, high-speed SMU (Source Measure Unit) has hit the European marketplace.
eBook pores over zonal architecture in automotive
Mouser Electronics has released a new eBook, in collaboration with TE Connectivity and sensors, and Microchip Technology.
ROHM’s EcoSiC used in COSEL’s 3.5kW AC/DC units
ROHM has announced the adoption of its EcoSiC products, including SiC MOSFETs and SiC Schottky barrier diodes (SBDs), in the HFA/HCA series of 3.5kW output AC/DC power supply units for three-phase applications from COSEL, a prominent power supply manufacturer in Japan.
Naoris Protocol announce post-quantum DePIN
Naoris Protocol has unveiled its Post-Quantum powered Decentralised Physical Infrastructure Network (DePIN) for cybersecurity and digital trust.
Automotive-compliant current shunt monitors
Diodes Incorporated (Diodes) has announced the ZXCT18xQ series of automotive-compliant high-precision current shunt monitors.
Rutronik expands diode portfolio
The 3rd generation of 1,200V SiC Schottky diodes (5 A – 40 A) with a MPS design from Vishay Intertechnology are expanding Rutronik's diode portfolio.
SI Sensors announces groundbreaking technology for imaging
SI Sensors is happy to announce a groundbreaking development in the field of high-speed imaging as it introduces the integration of Charge-Coupled Device (CCD) technology within Complementary Metal-Oxide Semiconductor (CMOS) image sensors.
Infineon’s 28nm security ICs and smart card solutions at TRUSTECH 2024
Higher efficiency and lower environmental footprint resulting in more powerful, sustainable applications: products manufactured in the 28 nanometer technology by Infineon Technologies are setting the tone in the security semiconductor industry since their introduction at TRUSTECH 2022.