Wireless

The IC substrate market is positioned for significant growth, with its value expected to rise from $15.1 billion in 2022 to nearly $29 billion by 2028.

Picocom, the 5G Open RAN baseband semiconductor and software specialist, has announced that it has launched PC805, a new system-on-chip (SoC) optimised for 5G small cell Open RAN radio units (O-RUs).

With the launch of devices based on the new Wi-Fi 7 communications standard, there is already a growing demand for test instrumentation that can evaluate them.

Ventec International Group will once again team up with partner Taiyo to promote the synergy between Ventec’s substrate materials and Taiyo solder masks, at Productronica 2023, Munich 14—17 November 2023 in Hall B3, Booth 242.

Arrow Electronics has announced a global distribution agreement with Truesense, a pioneering company in edge AI, software algorithms, and UltraWideBand (UWB) radar and ranging technology, to distribute Truesense modules, development kits, and software.

Nordic Semiconductor, a specialist in low power wireless IoT solutions, announces a significant addition to its nRF54 Series, its fourth generation of Bluetooth Low Energy Systems-on-Chip (SoCs).

Compared to other industries in APAC, which are at the forefront of innovation, digital transformation in the IoT space in Asia Pacific (APAC) has experienced slow progress.

The call for ‘more D band’ has gone out. With the ability to transmit 100 Gigabits per second (Gbps), the D band will unlock a number of technologies across a wide range of industries.

Testing RF components such as power amplifiers and front-end circuits demands sophisticated test equipment, with careful engineering of the test setup and control over the surrounding environment.

Global technology and software specialist Emerson is building upon the innovative technologies and solutions in the DeltaV distributed control system (DCS) with the release of DeltaV Version 15 Feature Pack 1.