XTPL enters manufacturing lines of modern electronics

The company will demonstrate the abilities of its Ultra-Precise Dispensing (UPD) technology, which has recently been introduced to the industrial market. This patented technology allows for the printing of electronically conductive or insulating structures on various substrates with precision, particularly valuable in mass production.

The event is scheduled from 14-17^th November in Munich, Germany. XTPL's booth in Hall B2.119 will feature the Ultra-Precise Dispensing technology. This technology paves the way for solutions previously deemed unattainable. Following its market debut with the Delta Printing System – a machine designed for prototyping and small-scale production, XTPL is now integrating this technology into production lines for modern electronics.

XTPL's Ultra-Precise Dispensing System, a single nozzle solution, is tailored for integration with advanced electronics production lines. Its high precision impacts two key application areas: heterogeneous integration and yield management, potentially enhancing traditional microelectronics manufacturing methods. The technology’s precision in the 0.50-10 micrometre range is now accessible on a mass scale across various industries.

Filip Granek, CEO at XTPL, stated: “Advancements in microelectronics are transforming how we connect and perceive the world around us. XTPL provides ultra-precise dispensing technology for microelectronics, which answers the demands of additive manufacturing and constant microelectronics miniaturisation. We are focusing on four market segments including consumer electronics with rapidly developing VR technology, healthcare industry, next-gen displays for automotive and airspace industries and research institutes."

The UPD technology enables ultra-precise dispensing of conductive traces and integration of heterogeneous elements, facilitating the combination of various electronic components into a single system or package. It is ideal in applications like flexible electronics, wearable devices, microelectronics packaging, IoT systems, and biomedical applications, offering flexibility, miniaturisation, and enhanced performance.

Additionally, UPD provides ultra-precise dispensing of conductive microbumps for 3D integrated circuits, advanced packaging, or system-on-chip designs, where compact, high-density interconnections are crucial. The precise placement of microbumps (below 50um diameter) improves performance, functionality, and form factor in heterogeneous systems.

Moreover, UPD enables ultra-precise dispensing of conductive or insulating material to microvias in advanced packaging techniques like flip-chip and through-silicon via (TSV) technologies, improving connections, thermal management, and miniaturisation in advanced packaging applications.

Lastly, UPD facilitates ultra-precise dispensing of conductive interconnections with microLEDs, supporting their integration into heterogeneous microelectronic systems. These interconnections manage control, driving, and power distribution for microLEDs, expanding potential applications in AR/VR devices, smartwatches, automotive displays, and more.

“The UPD Technology, used by both DPS and UPD System, is groundbreaking for several reasons. Firstly, it guarantees unprecedented precision in the 0.50-10 micrometre range, in which we are practically unrivalled. Secondly, it is an additive method, which allows significant time and material savings. Moreover, it offers scalability, cost-effectiveness, simplicity, and speed and all the above can be printed without the need to use an electric field. This solution finds application in the broadly understood additive manufacturing industry with a particular focus on microelectronics and microelectronics component manufacturers, including, but not limited to OLED and MicroLED displays, semiconductors, advanced PCBs or in the healthcare industry. UPD technology can also be used in R&D departments and development and academic centres working on solutions using additive micro-scale printing technology," said Granek.