Vertex II X-ray Inspection System from VJ Electronix

VJ Electronix will present the new Vertex II 130. The Vertex II, recent winner of the NPI Award, incorporates the latest advances in X-ray imaging components with off-axis viewing, all in a smaller footprint. The system offers VJE’s proven production readiness, superior uptime and unmatched value. The Vertex II can be configured with a variety of X-ray sources and detectors, and can be tailored to specific application needs.

The Vertex II is equipped with innovative Nexus 300 Inspection Software and analysis tools, providing manual operation or fully automated inspection routines. Nexus 300 image processing offers advanced defect enhancement, feature masking for double-sided PCB, pseudo colour, edge detection, BGA area, circularity, voiding, large area analysis and void ratio.

Also to be displayed will be the SRT Micra, VJE’s latest benchtop platform that is specifically designed for the rework of devices ranging from 01005 passives to large POP components. The Micra is a general purpose rework tool but also is designed to provide advanced rework capability to the latest high-density electronic designs and devices such as Smartphones, Tablets, GPS and other portable products. The new SierraMate V9 software simplifies process definition and ensures consistent, repeatable results between facilities and even continents. The systems’ revolutionary heaters and machine controls provide extremely high throughput and unmatched performance, regardless of typical variations in utilities, such as electrical power.

Also, the VJ Electronix rework product line includes the industry workhorse Summit 1800 rework platform that incorporates all of the innovative features that have been developed since the invention of high-level, semiautomatic surface mount and microelectronics rework technology.

Extensive field experience and user feedback have resulted in the development of rework systems that exceed current and future industry requirements. Advanced rework software with intuitive 1-2-3 Go! operator interface and Auto Profile maximizes ease of use and throughput, while maintaining the inherent capability to rework today’s most complex area-array components.