TRI launches high performance 3D SPI solution

With its high-speed platform, the TR7007Q SII delivers up to 50% faster inspection compared to previous models, ensuring manufacturers achieve high performance. The TR7007Q SII is equipped with a 9.8 μm high-resolution 21 MP camera, delivering enhanced measurement accuracy and stability, ideal for diverse industries. The 3D SPI's versatility ensures reliable and precise results. The TR7007Q SII can also effectively inspect Bumps, Flux, Mini LED Solder, and Bare Boards.

The 3D SPI's improved accuracy and stability enable precise solder measurements and minimise false calls, guaranteeing reliable inspection results. Equipped with a wide spectrum light system and coaxial lighting, the TR7007Q SII provides higher contrast, clarity, and uniformity significantly improving the detection rates.

The Smart 3D SPI solutions ease data exchange between the production line and the MES of your choice to enable data traceability for the connected factory. TRI's SPI platforms facilitate data exchange for closed-loop and support the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.