Thermal management enhancement expands IC test solutions

Utilising state-of-the-art system simulation models allows the company to optimise each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.

Traditional solutions including finned and liquid cooled heatsinks have been industry staples for many years but are limited in the amount of power they can support.

Smiths Interconnect has refined these options by introducing a Hi-Perform Liquid Cooled lid integrated with a Chiller as well as a Heatpipe - Heatsink variant. These next generation solutions expand testing capabilities through the ability to dissipate 650W.

These lids stabilise the junction temperature within a desired range allowing for IC testing at a higher thermal power point for a longer duration resulting in a far more accurate test.

“As next generation logic IC packages, central processing units (CPU) and graphic processing units (GPU) become more powerful they are generating an exponentially increasing amount of heat,” says Paul Harris, Sales & Marketing VP at Smiths Interconnect. “IC manufacturers and test houses must surmount thermal management challenges whilst maintaining low test costs, ensuring accurate test results and improving test throughput. Smiths Interconnect is positioned as a vital partner to meet these challenges with our thermal management solutions.”

Smiths Interconnect Thermal Management Solutions are developed specifically to a user’s exact application and can provide these additional benefits:

• Compatibility with conventional socket and lid-mounting design footprints allowing for simple conversion to an enhanced solution, therefore, increasing test accuracy.
• Availability of a compact, table-top chiller unit consuming minimal space in a test lab.
• Utilisation of existing test hardware, coolant mediums and air inlets, thereby requiring minimal investment for integration while reducing the overall cost of testing.