Test platform can scale up to 5000 display driver digitisers

Touch and display driver integration (TDDI) IC shipments continue to ramp, and are expected to hit the 500 million mark in 2018.

Driven by bezel-less display technology popular in the latest high-end smartphone designs, TDDI chips are seeing mainstream adoption after an extended incubation period.

TDDI chips offer clear benefits, such as lower cost, a thinner panel assembly, and better performance, over their discrete competitors. TDDI chips present significant challenges, however, for established display driver ATE solutions.

With the addition of the PD2X a specialised instrument designed to test leading edge display driver IC’s, the Diamond_x can help realise the full potential of TDDI.

With a scalable universal slot architecture, Diamond_x can scale up to over 5000 display driver digitisers, supporting aggressive multi-site production strategies.

Furthermore, with the introduction of the HSI1x 12.8Gbps SerDes test instrument, the Diamond_x has channel count and performance headroom to meet the future needs of the display driver digital interfaces.

Christopher Lemoine, Product Marketing Director, highlights: “Traditional display driver ATE systems are specialised systems designed to test the driver row/column drivers, power management, logic and memory functions found in display driver IC’s. Adding touch controllers to these chips exposes gaps in the capabilities of existing display driver ATE, and the limited scalability of these solutions inhibits the cost benefits of TDDI. With a wide range of general purpose digital, analog, mixed-signal, wireless, and power instrumentation, the Diamond_x is a well established leader in touch controller test. With the addition of the PD2x display driver digitiser instrument and the HSI1x 12.8Gbps SerDes test instrument, the Diamondx platform enables our customers to push the boundaries of performance, quality and cost-effectiveness of their TDDI products.”