Saki's next generation AOI systems on show at Nepcon Japan

Saki's new BF-3Di-D (dual lane) and BF-3Di-Z (extra-large platform) 3D AOI equipment provides measurements of components with a height range between 0 and 20mm, achieving 1-micron height resolution, a false call rate of less than 100 ppm with 0 escapes and an increased positioning speed of 50%. The new camera and lighting systems capture extremely clear, detailed images with no shadowing for inspection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations.

Saki will also be demonstrating its 3D automated x-ray inspection system that provides 100% head-in-pillow detection. This true 3D system takes up to 200 slices of a component and inspects and measures the solder joint structures, with on-the-fly reconstruction and volume measurements, for every solder joint, creating 3D data for the entire sample. The system perfectly separates the top and bottom sides of the PCB for extremely high resolution images and best-in-class Cpk and gage repeatability and reproducibility, which is especially needed for applications in the aerospace, medical, and automotive markets where reliability is critical.

"Saki has been the industry innovator that revolutionized 2D line-scan AOI over 21 years ago," said Kenji Nishida, Japan sales manager, Saki Corporation. "We offer a complete 3D line-up of SPI, AOI, and AXI and have over 15,000 systems installed globally. The entire 3D line-up shares the same software for easier programming and operation".