Saki to present advanced AOI at NEPCON Thailand

Saki's BF-3Di-L1 3D AOI system has a new optical head, side-angle cameras, and 4-stage ring lighting for optimum illumination and better visual image capture and measurement of the printed circuit board assembly, for all PCB configurations. The circular lighting gives more consistent illumination throughout the field of view, with brightness controlled and shadows eliminated no matter the height or density of the components. Side cameras capture angles to show side views that previously weren't visible. The result is improved accuracy and reliability.

This system inspects heights up to 20mm and parts as small as 01005s, capturing reversed or inclined components with an escape of less than 1 ppm. It can be used for simple set-ups, like golden board comparisons, or with its full algorithm-based capabilities for full measurement and inspection. The BF-10BT 2D offline AOI system simultaneously inspects both sides of the circuit board with user-selectable 10μm and 20μm dual-resolution, for the ultimate in double-sided PCB inspection. Its robust and highly repeatable hardware is built for 24/7 continuous operation. It inspects 01005 (0402) components and detects solder balls down to 150 microns with high speed and superior data handling. It can be used for final inspection, through-hole inspection after wave or selective soldering, or manual inspection.

"Exhibiting at NEPCON Thailand is a great way for us to show our new AOI systems to a larger number of people in Thailand and the Asia Pacific region," said Francis Wong, managing director of Saki Asia Pacific, Thailand. "Thailand has long been an important market for Saki. We have both an office and sales rep here."