Multitest Pulse Plating Process for Test Interface Boards

Originally the process was developed to support ultra high aspect ratio requirements at 0.4 mm pitch. Multitest has developed a customized plating process for small via diameters in high layer count PCBs used in ATE test. The process allows for .0051 diameter through-holes into PCBs with up to 40 layers.

The Multitest Pulse Plating Process is applied particularly to BGA and WLCSPs as well as for vertical probe applications. It eliminates the need for sequential lamination in most 0.4mm pitch applications. This same technology is deployed for 0.3mm pitch BGA applications with through-hole construction.