SPI's angle cameras measure solder paste deposit
Vi Technology's Pi SPI system offers the customer an immersive print process experience, with unparallelled vision and measurement capabilities. According to Vi, the Pi system is the first SPI to use angle cameras, in conjunction with 360° Moiré technology, to measure the solder paste deposit.
Taking approximately 352 images per field of view, Pi provides an ultra large image in 3D true colour, thanks to a computing system which, according to Vi, increases computing power by 100 times in comparison to conventional solutions.
By supporting a PCB capability of up to 533x600mm within an 800mm wide envelope, the system addresses the increasing constraints on floor space in modern SMD lines.
The 2K Spectro is the smallest system of Vi's K-series, with its effective footprint for PCB sizes not exceeding 14x14". 2K Spectro heads use an 8MP, 12-bit colour camera to enhance image quality with lower resolution and higher definition. Every stage of AOI usage will experience benefits, including higher efficiency with effective cycle times, faster programming and a friendlier, more intuitive UI for defect review.
Vi, accompanied by representative Fenwick Iberica, exhibited the Pi SPI system alongside the 2K Spectro at Matalec, October 28th to 31st 2014, in Madrid.
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