Powerful Data Capture, Analysis Featured in Protocol Analyser

14th May 2013

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A PCI Express protocol analyser with interchangeable interposers for probing has been unveiled by Teledyne LeCroy. The analyser supports PCIe data transmission rates up to 5GT/s and data lane widths up to x4 in a single compact unit measuring 9in. in width x 6.1in. depth x 1.7in. height. The company says that it provides a solution for system implementers by providing powerful data capture and analysis. It also supports upgrade paths from low-cost base units to higher data rates.

Teledyne LeCroy has introduced a PCI Express protocol analyser with interchangeable interposers for probing. The Summit T24 Protocol Analyser features a small chassis footprint while maintaining the same data analysis features found in the top-of-the-line Summit T3-16 protocol analyser. The new protocol analyser supports PCIe data transmission rates up to 5GT/s and data lane widths up to x4 in a single compact unit.

It provides a solution for system implementers by providing powerful data capture and analysis. It also supports upgrade paths from low-cost base units to higher data rates and larger lane size, to protect the customer’s investment in protocol analysis as their product requirements change. This flexible licensing allows users to get the features they need at a budget they can afford to get the job done.

“ If you are developing embedded boards for military and telecommunications, storage SSDs or consumer products, the Summit T24 is a very cost effective way to get the job done,” said John Wiedemeier, Product Marketing Manager for PCI Express Protocol Analysis, Teledyne LeCroy. “The new Summit T24 PCI Express 2.0 protocol analyser offers many of the same high-end features found in our larger platform protocol analysers.”

At only 9in. width x 6.1in. depth x 1.7in. height the analyser provides all this capability in a physical volume less than 50% of its predecessor. This provides cost savings and increased portability for sharing units within a lab or for field applications.

The Summit T24 supports all existing Teledyne LeCroy PCIe 1.0 and 2.0 application-specific interposers and probes, which allow quick and easy connection to a wide variety of different physical designs. Embedded board developers working with MicroTCA, ATCA, VPX, CompactPCI serial, XMC and similar form factors will appreciate this low cost analysis tool’s large portfolio of interposers. Each interposer is designed for reliable data transmission between hosts and devices and for quick set up times for testing new hosts or new devices.

It includes the same powerful PETracer software included with Teledyne LeCroy’s most advanced PCI Express protocol analysis systems.