Nordson showcases inspection and metrology solutions at SEMICON Taiwan

The event will take place 4–6 September 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan. In booth #L0516.

The company will be showcasing its inspection and metrology solutions, including the Quadra 7 Pro Manual X-ray Inspection (MXI) System, the new SpinSAM Acoustic Micro Imaging (AMI) system and the Gen 7 AMI system.  The company will also demonstrate the WaferSense Auto Teaching System (ATS2) for semiconductor tool set-up and maintenance.

The new Quadra 7 Pro MXI system sets a new standard for 3D/2D manual inspection in back-end semiconductor applications. Powered by the revolutionary Onyx detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection experience to new levels of precision and efficiency.

Equipped with the latest Dual Mode Quadra NT4 tube, the Quadra 7 Pro provides users with maximum flexibility. This innovative feature offers brightness and resolution modes, allowing operators to dynamically switch between them based on specific application requirements.

Enhancing the Quadra 7 Pro's capabilities is the newly developed Revalution software, tailored specifically for high-end semiconductor applications. With an intuitive interface, optimised workflow, and expanded functionality, Revalution software empowers operators to efficiently analyse and interpret inspection data, contributing to faster decision-making and improved overall productivity.

The new SpinSAM AMI system delivers throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies. The SpinSAM’s innovative spin scanning method scans up to 4 (300mm) wafers simultaneously at 41 wafers per hour, with the best-in-class defect capture and image quality.

With four matched waterfall transducers in a compact footprint, the system was meticulously engineered to attain full wafer scans in less than six minutes. Ideal semiconductor mid-end applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-moulded wafers, and more.

The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialised high-resolution applications.

The WaferSense Auto Teaching System (ATS2) is a multi-camera sensor that, when used in conjunction with CyberSpectrum software, enables accurate wafer hand-off calibration for semiconductor tool alignment and setup for front-end semiconductor fab environments. With the ability to capture three-dimensional offset data (x, y, and z) in real-time, ATS2 simplifies wafer position teaching without the need to open the tools. This results in repeatable and reproducible setups, streamlined maintenance checks, accelerated troubleshooting, and reduced technician-to-technician variation, leading to significant yield improvements and enhanced productivity for semiconductor fabs worldwide.

Nordson is a platinum sponsor of Semicon Taiwan and will be delivering a presentation titled ‘Revolutionary Acoustic Technology for Wafer-Level Applications’ at the Heterogeneous Integration Global Summit on 5th September at 11:50am local time at 701GH, 7F, Taipei Nangang Exhibition Center Hall 2.