Test & Measurement
MIRTEC will Present its Technologically Adavnced AOI Equipment at IPC Midwest 2012
MIRTEC has today revealed that it will be premiering its technologically advanced Automated Optical Inspection equipment in booth #109 at the upcoming IPC Midwest 2012, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, IL.
At tThe MV-3L also will be configured with four Ten Mega Pixel Side-View Cameras as well as MIRTEC’s exclusive Intelli-Beam Laser System. This advanced technology provides: Four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability in a cost effective desktop AOI system. The MV-3L is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool software provides automatic teaching of component locations using CAD centroid data.
“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” stated Brian D’Amico, president of MIRTEC’s North American Sales and Service Division. “We look forward to welcoming visitors to our booth #109 during the two-day event.”