MIRTEC Europe to Showcase AOI and SPI Inspection Systems at SMT Nuremberg 2011

The MIRTEC MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology and ‘Phase Stepping Image Processing’ to inspect solder paste deposition on PCB’s post-screen print. Far superior to laser SPI technology, the MS-11 will inspect for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 is configured with an ultra-high-resolution Camera for enhanced image quality and superior accuracy.
pb tec will demonstrate Mirtec’s total quality management system software, Intellisys. The software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies. Intellisys also provides remote debugging and monitoring of up to eight production lines, allowing MIRTEC customers to further maximize the efficiency of the inspection process. Typical programming time is under one hour per assembly. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.
During the SMT exhibition, pb tec will also exhibit the Mirtec MV-3 Series Desktop System, the industry’s most widely accepted Five Camera Desktop AOI System. The MV-3 Series features the Intelli-Beam Laser System and is configured with a Top-Down View Five Mega Pixel camera. The system also features Precision 9.8 Micron Telecentric Compound Lens and four Five Mega Pixel Side-View Cameras and a Remote Debugging Function for perfect re-inspection by the operator with 360° images from side on defect.
NEW for 2011 is the MV-7 Inline AOI system which is previewing Mirtec’s latest 3D AOI inspection technology. This “State of the Art” technology release is keenly anticipated as the next landmark set by the company.