Manage Power Dissipation During Test: Multitest’s MT9510 Provides Extended Temperature Control with XTC

Today, more and more ICs, e.g. graphic chips, require a medium range power dissipation control for the device under test (DUT). For most of these applications, it is not appropriate to invest heavily in established active thermal control (ATC) systems. Some semiconductor manufacturers try to solve this by developing proprietary solutions. However, this drains their resources in an area that is not their main business and does not really offer the advantages of a real “turnkey” solution.

Multitest’s thermal expertise has enabled the company to develop a unique solution based on XTC for medium range power dissipation up to 50 W. The die temperature inside the DUT is stabilized at a set temperature, avoiding a temperature drift after contacting.

The XTC is integrated into the conversion kit. In addition to cost efficiency, this ensures full availability for any MT9510 pick-and-place handler in the market.