Invites are out for Viscom's Technology Forum and User Meeting

Numerous workshops are open to Viscom customers but Viscom "newcomers" can arrange appointments to discuss specific questions in  "Meet the Expert" sessions. 

In addition to the practical examples, research is on the agenda at the Technology Forum and User Meeting 2016. A presentation from the Landshut University of Applied Sciences explores current studies of potential application areas for ribbon and bond connections. Two additional presentations are concerned specifically with solder joints. One of these investigates the influence of pores on the reliability of LED solder joints. Partners in this project are the Aschaffenburg University of Applied Sciences, the Fraunhofer Applications Center for Resource Efficiency and the Chair for Factory Automation and Production Systems (FAPS) of the Friedrich-Alexander-Universität Erlangen-Nuremberg. The goal of the study is to investigate application-specific limit values for the amount of pores in solder joints. Another presentation focusing on solder joints will deal with the influence of solder paste pressure on reliability of solder joints in critical ceramic SMD components on FR4 printed circuit boards. This involves an initiative of the Fraunhofer Institute for Silicon Technology (ISIT) that was concluded last year.

Murat Günak will hold the opening talk. Based on his experiences as head designer for leading automobile groups such as Peugeot, Daimler and Volkswagen, he will devote his presentation to what is now a red-hot topic, E-mobility, and to the effect of future mobility concepts, to give us an exciting view of the future of automotive development.

Viscom also will present its own interesting developments including Industry 4.0 and how it is put into practice at Viscom. A report from among the Viscom users, by DELTEC Automotive GmbH & Co. KG, illuminates the networking and digitalization of inspection gates to achieve a stable series process.