Inline 3D topographical & imaging AOI

The system is practically immune to vibrations from nearby placement machines which might otherwise cause blurry images and therefore inaccurate and non-repeatable results during production. It is able to inspect the world’s smallest chip size of 008004 (50% of 01005in) and features a full profile simultaneous 2D and 3D inspection while maintaining high inspection speed using patented sensor technology.

The image capturing sensor has a massive 12 Mega Pixel resolution with optical fibre interface. The ISO-Spector enables accurate height measurement by using front & rear, close to vertical, high energy, high-end violet lasers. These lasers, combined with proprietary algorithms, result in the minimization of blind spots (shadow) and the effect of reflecting objects. Warped PCB’s up to 4 mm (160 mils) are compensated for on the fly by the Z-axis and complex compensation algorithms.

Unique for these type of inspection systems, the ISO-Spector can be programmed and debugged offline using the offline programming and debugging stations. The 3D AOI system is ergonomically designed and operated via a full touch screen.