High Res 2D and 3D AOI Systems at NEPCON China

Saki's BF-10BT is ideal for double-sided PCB inspection. Its robust and highly repeatable hardware is built for 24/7 continuous operation. The system inspects both sides of the PCB in one process with 10μm resolution. It inspects 01005 (0402) components and detects solder balls down to 150μm with high speed and superior data handling capabilities. It's perfect for final inspection, through-hole inspection after wave or selective soldering, or manual inspection.

Saki's BF-10D handles dual-lane high speed production lines using only one head. Whether the two lanes have the same or different board configurations, they can be inspected simultaneously in one pass, making inspection very fast. When the same items are run in both lanes, the inspection programming data can be shared. The system uses a telecentric lens optical system to achieve 10μm resolution. Multiple data handling capabilities, such as programming data changes by barcode reading and data output to the customers' data servers, are available.

This newly introduced system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution. The new positioning system is 50% faster than Saki's previous 3D machine for an increased throughput of 15%. The camera and lighting systems capture extremely clear, detailed images with no shadowing for inspection of the most difficult defects, such as lifted leads, tombstones, reversed polarity, and height variations. The system is available for XXL sizes, in dual-lane configurations, or with optional side angle cameras.