Goepel's theme at SMT/Hybrid/Packaging 2010 is “Best in Test”

“The SMT show is an important indicator for the entire electronics production and neighbouring areas. The introduction of innovative products, which simply make the difference, has never been that critical before”, says Stefan Meissner, GOEPEL electronic’s spokesman. “Our AOI/AXI and Boundary Scan solutions have won several awards in the last few years. GOEPEL electronic’s product portfolio can rightly be designated as the ‚best in test’.”



Further developments and new applications of the unique rotatable angled-view module Chameleon are enhancing Automated Optical Inspection. Now, recorded PCB images and detected faults can be visualised in 3D. GOEPEL electronic invites all interested parties to experience this revolutionary presentation with respective 3D glasses directly at the Company’s stand.

Furthermore, the latest release of the AOI software “OptiCon PILOT” will be introduced, containing numerous new functions for higher operator comfort, faster test program generation and enhanced fault visualisation.



From 8th to 10th June 2010, awarded solutions and innovations in JTAG/Boundary Scan can be found on GOEPEL electronic’s stand. Among others, the production tester JULIET, which recently won the „Best in Test Award 2010“ for being the globally most innovative Boundary Scan tool, will be exhibited.

Additionally, a new low-cost Boundary Scan controller for the PCIe bus, VarioTAP® support for AMCC processors as well as the new opportunity of a STIL Vector export in the Boundary Scan software SYSTEM CASCON will be introduced.



Interested parties may also discuss the benefits of various test methods to increase their test coverage and closing test gaps. GOEPEL electronic being unrivalled in this field of technology offers a wide range of test technologies providing a one-stop shop for test and inspection.