"Deal of the Year" offered on solder paste inspection system
GOEPEL electronics is offering what it describes as “the deal of the year” to mark the anniversary of its high-performance system for three-dimensional solder paste inspection SPI-Line 3D. The system features a 3D camera head allows precise three-dimensional measurement of printed solder paste for the quality assessment of shape, area, volume and planarity.
With up to 180 frames per second and high-precision fringe projection technique, a reliable and quick inspection is guaranteed.
The system software SPI-Pilot with touchscreen interface offers efficient and easy programming: test programs can be created in less than 10 minutes. In addition, an offline programming station and a module for SPC evaluation (Statistical Process Control) is available.
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