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GOEPEL electronic will exhibit leading Test Equipment at NEPCON Shenzhen 2011

29th July 2011

ES Admin

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At this year’s NEPCON Shenzhen, GOEPEL electronics Ltd. Asia will present its latest offerings in Multi-Dimensional Boundary Scan Instrumentation as well as chip embedded test, debug and programming tools. By visiting booth 1C27 within the “German Pavillion”, visitors can learn how to enable straightforward control of on-chip or on-system test, debug and programming functions of any complexity, based on the IEEE 1149.1 test bus protocol – fully synchronous with other JTAG/Boundary Scan operations. The spectrum of possible applications ranges from simple register control, over utilisation of primitive test functions, to control of complex instruments. Additionally, GOEPEL electronic will demonstrate support for new and future JTAG/Boundary Scan related standards such as IEEE 1149.7 or IEEE P1687.

GOEPEL introduced nearly 40 new and partly revolutionary Boundary Scan software and hardware products in 2010 and 2011, and will demonstrate how users can save time and money by applying technology-leading test equipment. Visitors can also inform about Boundary Scan integration opportunities into other automated test equipment such as In-Circuit-Testers, Flying Probers, MDA, Functional Test Systems and Automated Optical Inspection Systems.

From August 30th to September 1st 2011, visitors are welcome to find how GOEPEL electronic can provide test solutions to “Get the total Coverage!” for design, production and test engineers.